3DIC Platform Wet and Plating Development Manager

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 181,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

On-site role in Hillsboro

Job summary

Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean and Plating technology development for the 3DIC platform in Hillsboro, Oregon. You will manage a team of process engineers and influence the roadmap for advanced packaging.

The role requires strong leadership, project execution, and cross-functional collaboration with process integration and manufacturing operations to deliver production-worthy processes for high-volume manufacturing.

Qualifications

• Master or PhD with 8+ years for Master’s track; 6+ years with PhD.
• Experience with wet etch/clean and plating platforms; cross-functional projects.
• DOE principles and problem-solving in packaging interconnects.

Responsibilities

• Lead and manage a team of engineers with clear goals and coaching.
• Formulate long-term process roadmaps to meet future requirements.
• Oversee development of production-ready wet etch/plate processes for high-volume manufacturing.
• Develop talent and foster an inclusive, high-performing team culture.
• Create and manage project schedules with cross-functional teams and milestones.
• Drive yield improvement and defect reduction in wet etch/clean and plating modules.
• Collaborate with process integration and manufacturing to ensure seamless tech transfer.

Skills

Project management

Team leadership

Cross-functional collaboration

DOE principles

Education

Master's degree in Chemistry or related field

PhD in Chemistry or related field

Tools

Wet etch equipment

Plating platforms

Job description

## 3DIC Platform Wet and Plating Development ManagerApply: US, Oregon, Hillsboro: Full time: Posted Today: JR0287869# **Job Details:**## Job Description:Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3DIC platform. This role will drive the development and implementation of Wet Clean/Plating processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in Wet and Plating system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.**Key Responsibilities*** Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment* Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging* Oversee development of production-worthy wet etch/plating processes for high-volume manufacturing* Foster talent development for critical technical roles, and drive technical excellence and innovation within the wet etch(clean)/plating team* Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams* Drive Wet Etch(clean) and Plating module and segment related yield improvement initiatives and defect reduction programs* Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing**The candidate should exhibit the following behavioral traits:*** Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.* Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.## **Qualifications:**You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.**Minimum Qualifications*** Master or PhD degree in Chemistry, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, or a related field, with 8+ years of relevant experience at a Master's degree, 6+ years or experience with a PhD degree.* The experience listed above should include a combination of the following qualifications: + Wet Etch/Clean or Plating experience and hands-on experience working with various wet etch and/or plating platforms. + Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.**Preferred Qualifications*** Build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.* Rich experience with vendor relations, including material quality assessments and performance management.* Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.## Job Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Oregon, Hillsboro## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.