Process Engineering Intern

Texas Instruments Incorporated

Lehi (UT)

On-site

USD 28,000 - 34,000

Part time

7 days ago
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Job summary

Texas Instruments Incorporated is seeking a Process Engineering Intern within the Analog Technology Development (ATD) Group. The role focuses on defining interconnect processes and flows to achieve reliable, low-resistance metal systems for power devices and high-precision components.

As part of the ATD team, you will define test circuits, analyze yield data, assess interconnect reliability, and collaborate to meet yield and reliability goals across technology nodes.

Responsibilities

  • defining electrical test circuits to assess process capability versus design rule
  • characterizing and analyzing process yield data
  • assessing the reliability of the metal and dielectric of the interconnect system
  • working within the team to drive the necessary actions to meet yield and reliability needs for the technology

Job description

Change the world. Love your job.

Texas Instruments is seeking a Process Engineering Intern within the Analog Technology Development (ATD) Group. We work to define and develop the next generation process and device technologies for TI. The metal system is critical for achieving reliable, low resistance interconnects for power devices, for enabling area scaling and high process yields to drive cost leadership and to achieve high precision resistors and capacitor components. The interconnect process integration engineer is a key member of a team that defines and develops the processes and process flows to achieve the interconnect performance and reliability needs, whether it be low resistance with good electro-migration capability for the latest high current applications or high precision resistors for high performance amplifiers. The role includes activities such as:

  • defining electrical test circuits to assess process capability versus design rule,
  • characterizing and analyzing process yield data,
  • assessing the reliability of the metal and dielectric of the interconnect system,
  • and then working within the team to drive the necessary actions to meet the yield and reliability needs for the technology.
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