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Texas Instruments Incorporated is seeking a Process Engineering Intern within the Analog Technology Development (ATD) Group. The role focuses on defining interconnect processes and flows to achieve reliable, low-resistance metal systems for power devices and high-precision components.
As part of the ATD team, you will define test circuits, analyze yield data, assess interconnect reliability, and collaborate to meet yield and reliability goals across technology nodes.
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Texas Instruments is seeking a Process Engineering Intern within the Analog Technology Development (ATD) Group. We work to define and develop the next generation process and device technologies for TI. The metal system is critical for achieving reliable, low resistance interconnects for power devices, for enabling area scaling and high process yields to drive cost leadership and to achieve high precision resistors and capacitor components. The interconnect process integration engineer is a key member of a team that defines and develops the processes and process flows to achieve the interconnect performance and reliability needs, whether it be low resistance with good electro-migration capability for the latest high current applications or high precision resistors for high performance amplifiers. The role includes activities such as: