Process Engineer, Texas Institute for Electronics

University of Texas; Austin, Northern (TX, KY); Hybrid; USD 90,000 - 135,000; Full time

Benefits offered by this job

Health benefits

Tuition assistance

LinkedIn Learning access

Employee discount programs

Job summary

The University of Texas at Austin's Texas Institute for Electronics (TIE) seeks a Process Engineer to develop and execute advanced semiconductor fabrication processes for HI applications. You will work across diverse equipment, run experiments, analyze data, document processes, and present results for feedback to the engineering team.

Role requires strong teamwork, communication, and ability to thrive in a fast-paced, dynamic environment.

Qualifications

• Degree or equivalent experience in a relevant engineering/science field.
• Experience with nanofabrication and wafer processing in cleanrooms.
• Familiarity with standard semiconductor equipment and processes (lithography, deposition, etch, CMP).

Responsibilities

• Run, develop, and integrate semiconductor fabrication processes across equipment.
• Create processes of record and implement on product samples for customers.
• Assist with proposals or reports on costs and inventory levels.

Skills

Semiconductor fabrication

Wafer processing

Nanofabrication

Process development

Data analysis

Documentation

Team collaboration

Education

Bachelor's degree in materials science/physics/chemical engineering or related field

Master's degree in relevant discipline (preferred)

Tools

Semiconductor equipment (lithography, coating, etch)

Metrology & inspection

Cleanroom exposure

Job description

**Job Posting Title:**Process Engineer, Texas Institute for Electronics**----****Hiring Department:**Texas Institute for Electronics**----****Position Open To:**All Applicants**----****Weekly Scheduled Hours:**40**----****FLSA Status:**To Be Determined at Offer**----****Earliest Start Date:**Ongoing**----****Position Duration:**Expected to Continue**----****Location:**PICKLE RESEARCH CAMPUS**----****Job Details:**## General NotesThis position may be filled at a higher-level title, relative to experience and qualifications of the selected candidate. Relocation assistance may be available.The is a rapidly growing public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. We are seeking a number of motivated individuals to join our team and help us achieve our mission.TIE is one of the fastest growing research centers at the University of Texas at Austin and part of the , a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation’s most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care. Situated in the heart of Austin — named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Cockrell School embodies the city’s innovative spirit.UT Austin, recognized by Forbes as one of , provides outstanding and packages that include:* Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)* Voluntary Vision, Dental, Life, and Disability insurance options* Generous paid vacation, sick time, and holidays* Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds* Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)* Flexible spending account options for medical and childcare expenses* Robust free training access through LinkedIn Learning plus professional conference opportunities* Tuition assistance* Expansive employee discount program including athletic tickets* Free access to UT Austin's libraries and museums with staff ID card* Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card* For more details, please see: and## PurposeThe Process Engineer develops and executes semiconductor fabrication process flows for advanced 3D HI applications using a wide variety of internal and external fabrication resources.## Responsibilities* Running, developing and integrating semiconductor fabrication processes across a wide variety of semiconductor equipment. This would include running experiments, performing detailed process characterization, performing data analysis, documentation of processes of record, presentation of results, and incorporating feedback from engineers/techs.* Developing processes-of-record and implementing these on product samples for customers.* Assisting with documents such as proposals or reports on costs and inventory levels.## Required Qualifications### **Process Engineer I:**High School Diploma or GED and at least ten years of experience in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines, or,Bachelor's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and at least six years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.### **Process Engineer II:**Bachelor's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and eight years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection, or,Master's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and six years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.### **Senior Process Engineer:**Bachelor’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and ten years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection, orMaster's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and eight years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.### **For all levels:*** Goal-oriented and ability to prioritize and multitask.* Demonstrated excellent written and verbal communication skills.* Demonstrated ability to work successfully in a collaborative team environment.* Ability to work effectively in a dynamic and fast paced environment.*Relevant education and experience may be substituted as appropriate.*## Preferred Qualifications### **Process Engineer I:**Three years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.### **Process Engineer II:**Master's degree or higher. Five or more years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet