Process Engineer - H1

QCi; Tempe (AZ); On-site; USD 90,000 - 130,000; Full time

Job summary

A technology company is seeking a Senior Process Engineer in Tempe, AZ to lead development and optimization of manufacturing processes for photonic integrated circuits. Candidates should possess a Master’s or Ph.D. in a relevant field and have over 5 years of experience in process engineering. The role requires collaboration across teams and strong problem-solving skills, especially with metrology tools. The company values innovative thinkers eager to support high-priority customer projects in a cleanroom environment.

Qualifications

• 5+ years of experience in process engineering.
• Strong background in measurement/design of photonic integrated circuits.
• Must have or be able to obtain a US DoD Security Clearance.

Responsibilities

• Lead the development and optimization of manufacturing processes.
• Drive process integration and improvement initiatives.
• Troubleshoot process deviations and implement corrective actions.

Skills

Process engineering

Metrology tools

Problem-solving

Data analysis

Education

Master’s or Ph.D. in Materials Science, Electrical Engineering, Physics, or related field

Tools

CD SEM

Profilometry

XPS

XRD

Job description

Senior Process Engineer - H1

Location: Tempe, AZ

Department: Operations

Reports to: Director of Manufacturing Operations

About Us

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security as well as remote sensing applications.

Position Description

QCi is seeking a highly motivated senior process engineer to join our team to support several high priority customer projects. In this role, the candidate will work collaboratively with a cross functional team of process engineers, PIC designers, RF designers, and PIC characterization engineers to fabricate non-linear photonic integrated circuits based on thin film lithium niobate. The ideal candidate will have several years of process development experience in etching (chemical etch, plasma etch, ion beam etch), deposition (electron beam evaporation, sputtering), lithography (photolithography, electron beam lithography) and metrology (SEM, AFM, TEM, stylus profilometry, white light interferometry).

Duties and Responsibilities

• Lead the development and optimization of manufacturing processes of thin film lithium niobate photonic integrated circuits
• Drive process integration and improvement initiatives to enhance device performance and yield.
• Work closely with the process team in the cleanroom to optimize associated metrology measurements in the fabrication flow of TFLN chips
• Collaborate with stakeholders across the manufacturing organization, including the design and measurement teams to deliver high quality photonic integrated circuits.
• Utilize advanced metrology tools such as CD SEM, AFM, ellipsometry, profilometry, XPS, XRD, and optical interferometry for process characterization and defect analysis.
• Troubleshoot process deviations, particle contamination, and performance issues and implement corrective actions and continuous improvement strategies.
• Support high priority customers throughout the design, fabrication and testing phases of their projects

Required Skills and Experience

• Master’s, or Ph.D. in Materials Science, Electrical Engineering, Physics, or related field.
• 5+ years of experience in process engineering,
• Strong background in measurement and / or design of photonic integrated circuits
• Hands‑on experience with metrology tools such as CD SEM, Alignment, Film Thickness Characterization, Particle Measure for process verification and defect analysis.
• Strong problem‑solving skills with experience in data analysis, SPC, and DOE.
• Ability to work in a cleanroom environment and interface with cross‑functional engineering teams.
• Must have or be able to obtain a US DoD Security Clearance.

Preferred Qualifications

• Ph.D. in Materials Science, Electrical Engineering, Physics, or related field.
• Experience and understanding of microfabrication for photonics devices, process integration, photonic materials properties and modification, and the incorporation of MEMS and electronic devices.
• Experience modeling and measuring photonic integrated circuits
• Experience with microwave and or RF photonics
• Experience with heterogeneous bonding between wafers and chips is valued.
• Experience working with 5S, and 6 Sigma

Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above.

Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.