Process Engineer: Dry Etch, DOE & Advanced Nodes

Actalent; Beaverton (OR); On-site; USD 100,000 - 160,000; Full time

Job summary

Actalent seeks a Process Engineer to join our Hillsboro, OR team, focusing on advanced dry etch development. You will run experiments, generate detailed reports, and present findings to project teams.

The position supports process development, optimization, and DOE-driven tuning to meet specifications and performance targets, with production-readiness planned in 3–5 years. The role requires extensive experience in semiconductor dry etch/plasma etch processes, SPC proficiency, and collaboration

Qualifications

• 10+ years of experience in dry etch/plasma etch processes in semiconductor (experience with Applied Materials, TEL, Lam preferred).
• 5-15 years of experience as a Process Engineer in semiconductor manufacturing.
• Proficiency in process improvement, manufacturing engineering, tooling, thin film, experimental processes, and statistical process control (SPC).

Responsibilities

• Conduct experiments for customer projects and provide detailed reports and presentations regularly.
• Support the development of advanced dry etch processes to achieve customer tool-of-record selections.
• Execute process development, optimization, and DOE-driven tuning to meet customer specifications, performance targets, and device integration requirements.
• Collaborate with Process Technicians and Analytical Team members on the process development cycle.

Skills

Dry etch/plasma etch

Process engineering

SPC (statistical process control)

Manufacturing engineering

Process improvement

Tools

Applied Materials equipment

TEL equipment

Lam equipment

Kokusai equipment

SCREEN equipment

Job description

Actalent seeks a Process Engineer to join our Hillsboro, OR team, focusing on advanced dry etch development. You will run experiments, generate detailed reports, and present findings to project teams.

The position supports process development, optimization, and DOE-driven tuning to meet specifications and performance targets, with production-readiness planned in 3–5 years. The role requires extensive experience in semiconductor dry etch/plasma etch processes, SPC proficiency, and collaboration