Process Development Engineer

Headway Technologies; Milpitas (CA); On-site; USD 96,000 - 143,000; Full time

Job summary

A leading company in the semiconductor industry is seeking a Dry Etch Process Development Engineer to develop and implement innovative etch processes. The role involves collaborating with various teams, conducting experiments, and ensuring product manufacturability. Candidates should possess a relevant degree and experience in the field, with strong problem-solving and communication skills. This full-time position offers a competitive salary and benefits.

Qualifications

• 1-3 years experience in dry etch process development.
• Experience in wafer fab manufacturing environment.

Responsibilities

• Develops and implements new dry etch processes for magnetic recording heads.
• Analyzes data and develops recommendations for improving performance.

Skills

Communication

Problem Solving

Organizational Skills

Education

Bachelor’s degree in Materials Science

Master’s degree preferred

Tools

Microsoft Office

Statistical Process Control (SPC)

Job description

Direct message the job poster from Headway Technologies

Senior Compensation and Talent Acquisition Professional

TITLE: DRY ETCH PROCESS DEVELOPMENT ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR, DRY ETCH PROCESS DEVELOPMENT

SUMMARY:

Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer is responsible for developing and implementing new RIE, IBD, and ashing processes for next-generation magnetic recording heads. This includes implementing new process control schemes to ensure product manufacturability, designing and conducting experiments, analyzing data, and presenting findings. The role also involves researching, selecting, and qualifying new tools to improve efficiency and yield. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

1. Develops and implements new dry etch processes (RIE, IBE, and Ashing) for next-generation magnetic recording heads.
2. Implements new process control schemes or methodologies to ensure product manufacturability.
3. Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap.
4. Adheres to timelines for introducing new processes into the manufacturing line.
5. Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective actions.
6. Partners with other groups and departments, including process and product engineering, to develop and deliver products and programs.
7. Oversees the work of Process Technicians to ensure accurate process execution and efficient wafer disposition.
8. Collaborates with Equipment Engineering to research, select, and qualify new RIE tools.
9. Adheres to all safety policies and procedures.
10. Performs other duties of a similar nature or level.

MINIMUM QUALIFICATIONS:

1. Bachelor’s degree in Materials Science, Physics, or Electrical Engineering, or equivalent relevant experience; Master’s degree preferred.
2. One to three years of experience in dry etch process development within the magnetic recording head, hard disk drive, or semiconductor industry.
3. Experience working in a wafer fab manufacturing environment.
4. Experience with Statistical Process Control (SPC).
5. Proficient in Microsoft Office applications.

Knowledge, Skills, and Abilities:

• Knowledge of semiconductor or HDD industry principles, practices, and techniques.
• Knowledge of wafer fabrication processing, including process development and integration.
• Knowledge of Reactive Ion Etching (RIE), IBE, and Ashing principles and techniques.
• Ability to analyze data from TEM, SEM, and FIB tools to determine root causes of failures.
• Proficiency in Microsoft Office and SPC tools for data analysis, reporting, and presentation.
• Effective communication skills, both verbal and written, with all levels of staff and management.
• Ability to work collaboratively and productively with diverse teams.
• Adherence to safety policies and procedures.
• Strong organizational, time management, problem-solving, and troubleshooting skills.
• Flexibility and prioritization skills.

The annual base salary for this full-time position ranges from $96,655 to $142,140, plus bonus and benefits. Compensation may vary based on responsibilities, experience, and education. The salary range is subject to periodic updates.

WORKING CONDITIONS:

The Dry Etch Process Development Engineer primarily works in an office environment, Monday through Friday. The schedule may change as needed. Travel to different sites may be required. Work in a class 100 ESD-sensitive wafer fab environment may expose the employee to hazardous chemicals, fumes, vapors, noise, and physical activity such as standing, walking, bending, and twisting. The role involves operating computers, entering data, and occasionally lifting up to 10 pounds. All safety policies must be followed.

Additional duties may be assigned as necessary.

Headway Technologies, Inc. is an equal opportunity employer. Accommodation requests should be directed to Human Resources.