Principal Thermal & Multiphysics Program Manager

Insight Global; Austin (TX); On-site; USD 140,000 - 210,000; Full time

Job summary

Insight Global is seeking a Principal Thermal & Multiphysics Engineer Program Manager in Austin, TX to oversee hands-on simulations for advanced 2.5D/3.0D heterogeneous integration. You will coordinate models with EDA vendors, OSATs, and foundries, and mentor engineers while aligning with industry standards.

The role requires 7+ years in thermal/multiphysics, strong scripting, and a MS/PhD in a related field.

Qualifications

• 7+ years of hands-on experience in thermal & multiphysics simulations.
• Experience with program management and customer/vendor interfaces.
• Proven ability to develop and validate package-level models for design enablement.

Responsibilities

• Lead hands-on thermal and mechanical simulations for 2.5D/3.0D heterogeneous integration.
• Model, extract, and verify high-speed interconnects, power delivery, thermal management, and stress across multi-material packages.
• Build and validate ADK/PDK models representing package behavior for system-level co-design.
• Run end-to-end simulation workflows with reliability checks and cross-domain co-simulation.
• Collaborate with EDA vendors, OSATs, and foundries to develop and refine simulation flows.
• Mentor junior engineers and represent the team in design reviews and industry forums.

Skills

Thermal & multiphysics simulations

Program management

Scripting/Automation (Python/Tcl)

Cross-functional collaboration

Education

Bachelor's in Electrical/Computer Engineering or Applied Physics

MS or PhD in Electrical Engineering/Applied Physics or related

Tools

Ansys HFSS/SIwave

Cadence Sigrity/Clarity

Synopsys RaptorX

Siemens HyperLynx

Keysight ADS

COMSOL

CST Studio

Job description

Job Description

Insight Global is looking for a Principal Thermal & Multiphysics Engineer Program Manager that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. This will be the day-to-day execution and sponsor interface for a large, complex, government-funded program with high visibility and rigorous reporting and tracking responsibilities.

This role is to lead and execute comprehensive thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

Responsibilities:

Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates. Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design. Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains. Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows. Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams. Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies. Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums. Other related functions as assigned.

Skills and Requirements

7 or more years of direct, hands-on experience in thermal & multiphysics simulations. Program management experience working with customers and EDA vendors. Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio. Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows. Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows. BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline. MS or PhD in Electrical Engineering, Applied Physics, or related discipline. 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms. Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.). Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal employment opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment without regard to race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request to [e-mail].