Principal / Senior Principal Plasma Etch Process Engineer

Northrop Grumman Corp. (AU); Linthicum (MD); On-site; USD 105,000 - 158,000; Full time

Job summary

An established industry player seeks a Principal/Senior Principal Plasma Etch Process Engineer to join their Advanced Technology Lab. This role offers the chance to work on innovative semiconductor technologies that shape the future. You'll be responsible for process development and optimization, ensuring compliance with safety and operational standards. The ideal candidate will have a strong background in semiconductor fabrication and excellent communication skills. Join a pioneering team where your contributions will make a significant impact in a collaborative environment.

Benefits

Relocation Assistance

Diverse Workforce

Equal Opportunity Employer

Qualifications

• 5+ years experience in semiconductor fabrication required for Principal role.
• 8+ years experience in semiconductor fabrication required for Senior role.

Responsibilities

• Develop and optimize plasma etch processes for semiconductor manufacturing.
• Support SPC and continuous improvement efforts.

Skills

Plasma Etch Processes

Semiconductor Fabrication

Metrology Processes

Statistical Process Control (SPC)

Problem-Solving Skills

Communication Skills

Education

Bachelor’s Degree in Materials Engineering

Master’s Degree in Engineering or Physics

PhD in related discipline

Tools

Semiconductor Manufacturing Equipment

Data Analysis Software

Job description

Requisition ID: R10180620

• Category: Engineering

• Location: Linthicum, Maryland, United States of America

• Clearance Type: Secret

• Telecommute: No - Teleworking not available for this position

• Shift: 1st Shift (United States of America)

• Travel Required: Yes, 10% of the Time

• Relocation Assistance: Relocation assistance may be available

• Positions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity, and bringing your whole self to work.

The Northrop Grumman Microelectronics Center (NGMC) is seeking an exceptionally talented, motivated, and creative Principal / Senior Principal Plasma Etch Process Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland. We design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs.

The candidate must be a strong team participant, have excellent communication skills, and be resourceful and multitalented. A strong understanding of semiconductor technology, metrology processes, and equipment engineering is essential.

The Principal / Senior Principal Plasma Etch Process Engineer will be responsible for but not limited to:

• All aspects of process development, optimization, and ownership of Plasma Etch processes for semiconductor manufacturing including process qualifications, technician training and certification, and process safety.

• Interfacing with other unit process engineers and product integration engineers to develop plasma etch processes to support emerging technologies.

• Supporting statistical process control (SPC) and continuous improvement efforts.

• Establishing standard operating procedures and engaging the operations team to ensure compliance.

• Responsible for the procurement and start-up of new process equipment and processes.

• Performing all other related duties as assigned.

This requisition may be filled as a Principal Plasma Etch Process Engineer or Senior Principal Plasma Etch Process Engineer.

Basic Qualifications Principal Plasma Etch Process Engineer:

• Bachelor’s Degree in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 5 years technical related experience in semiconductor fabrication; Master’s Degree with 3 years’ experience; or PhD with 0 years’ experience.

• Development and optimization understanding of plasma etch processes to meet physical and electrical requirements of superconducting and/or silicon technologies/devices. Able to work independently with hands-on experience in operating tools, gathering, and analyzing data.

• Good interpersonal and communication skills, both written and verbal, with problem-solving skills.

• US citizenship required.

• Must be able to obtain and maintain a Secret Clearance.

Basic Qualifications Senior Principal Plasma Etch Process Engineer:

• Bachelor’s Degree with 8 years technical related experience; Master’s degree with 6 years of experience; or PhD with 3 years of experience.

• Development and optimization understanding of plasma etch processes. Able to work independently with hands-on experience.

• Good interpersonal and communication skills, both written and verbal, with problem-solving skills.

• US citizenship required.

• Must be able to obtain and maintain a Secret Clearance.

Preferred Qualifications:

• Process development experience in Plasma Etching.

• Experience in superconductor microelectronics is highly desired.

• Experience in lean manufacturing practices and structured problem-solving methodology.

• User of various software packages commonly found in Semiconductor Wafer Fabs.

• Active Secret Clearance.

Salary Range: $105,400 - $158,000

Salary Range 2: $131,100 - $196,700

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.