Principal/ Senior Principal Electromechanical Design Engineer - R10192214

Northrop Grumman; Baltimore (MD); On-site; USD 80,000 - 120,000; Full time

Job summary

An established industry player is seeking a Principal/Senior Principal Electromechanical Design Engineer to lead the design and prototyping of advanced multi-chip modules and circuit assemblies. This role involves collaboration with a cross-functional team, providing technical leadership, and ensuring project milestones are met within budget. The ideal candidate will have a strong background in electrical and mechanical engineering, experience with PWB design, and proficiency in design tools like AutoCAD and Xpedition. Join a forward-thinking company where your expertise will contribute to cutting-edge technology and innovative solutions.

Qualifications

• 5+ years of experience in mechanical or electrical engineering.
• Proficient in PWB/CCA design and signal routing.

Responsibilities

• Design and prototype RF and mixed signal modules and boards.
• Lead and mentor less experienced engineers in a cross-functional team.

Skills

PWB/CCA design

Signal routing

Technical leadership

Mentoring

Communication

Education

Bachelor's degree in Mechanical Engineering

Master's degree in Electrical Engineering

PhD in Computer Science

Tools

AutoCAD

Xpedition

Job description

Job Title: Principal/ Senior Principal Electromechanical Design Engineer

Location: Baltimore, Maryland, United States of America

Responsibilities:

1. Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
2. Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
3. Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
4. Providing technical leadership and mentoring to less experienced personnel.
5. Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.

Minimum Qualifications:

1. Bachelor's degree with 5 years of experience, a master's degree with 3 years of experience or a PhD with 1 year of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement.
2. Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate PWB layout.
3. Proficient with AutoCAD and/or Xpedition software.
4. U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.

Preferred Qualifications:

1. Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
2. Active DoD Secret Clearance or higher.
3. Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.
4. Familiarity with thermal and structural analysis considerations, methodologies, and software tools.
5. Experience with hands-on assembly and testing of prototype electronic hardware.
6. Experience in a technical leadership role on a cross-functional product development team.
7. Experience routing RF signals.

Work Location: Onsite

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