Principal RF/mmWave IC Layout Design Engineer – TeraWave

Blue Origin; San Diego (CA); On-site; USD 180,000 - 280,000; Full time

Benefits offered by this job

Relocation assistance

Travel up to 10%

Job summary

Blue Origin is seeking a Principal RF/mmWave IC Layout Design Engineer to lead the physical implementation of RF/mmWave ICs for advanced payloads and communication systems. You will drive high-performance RF/mixed-signal layout and work with RFIC, analog, and mixed-signal teams to ensure tape-out readiness and optimal integration.

Ideal candidates have 10+ years of experience, proven tape-outs, and strong leadership to mentor across locations.

Qualifications

• 10+ years of RF/mmWave, analog, or mixed-signal IC layout and physical implementation.
• Hands-on RF/mmWave layout experience in RF CMOS/SOI/SiGe or similar processes.
• Multiple IC product lifecycles or tape-outs, preferably high-volume or mission-critical.

Responsibilities

• Lead the physical design and implementation of RF/mmWave ICs including PAs, LNAs, phase shifters, VGAs, mixers, VCOs and more.
• Drive block-to-top integration: floorplanning, power/ground, routing, ESD, pads, density fill, DFM.
• Lead compact layout approaches to optimize RF performance, isolation, area, reliability and manufacturability.
• Perform and debug physical verification: DRC, LVS, ERC, antenna checks, density checks, sign-off.
• Support parasitic extraction and post-layout analysis; resolve performance and EM issues with circuit designers.
• Develop layout schedules, manage risks, and align layouts with tape-out milestones.
• Release final layout databases to foundry with tape-out readiness support.
• Lead layout reviews, define best practices, mentor junior engineers.
• Coordinate layout execution across internal teams, partners, and multiple locations.

Skills

RF/mmWave layout

Chip layout

TX/RX front-ends

Floorplanning

Parasitic extraction

Education

B.S. in Electrical Engineering

Tools

DRC/LVS/ERC tools

Job description

Application close date:
Applications will be accepted on an ongoing basis until the requisition is closed.
At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We're working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!

Blue Origin is pioneering the future of space-based connectivity with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This network will service tens of thousands of enterprise, data center, and government users who require reliable connectivity for critical operations.

Job Description

We are seeking a Principal RF/mmWave IC Layout Design Engineer to lead the physical implementation and top-level integration of state-of-the-art RF/mmWave integrated circuits at Blue Origin. In this role, you will drive custom layout for high-performance RF, mmWave, analog, and mixed-signal ICs used in advanced payloads, terminals, and next-generation communication systems.
You will work closely with RFIC, analog, and mixed-signal teams to implement and integrate cutting-edge front-end circuits. Your leadership in block-level execution, chip-level planning, physical verification, parasitic optimization, and tape-out readiness will be critical to realizing compact, high-performance RF/mmWave system architectures.
This role requires deep hands-on expertise in RF/mmWave layout, strong technical leadership, and the ability to guide layout methodology, mentor contributors, and coordinate execution across internal and external teams. Your work will directly support Blue Origin's mission of enabling millions of people to live and work in space for the benefit of Earth.

Special Mentions

Relocation provided.
Travel expected up to 10% of the time.
Interviews will include a technical assessment.
This role is based onsite in San Diego, CA (preferred); or Cupertino, CA.

Responsibilities Include but Are Not Limited To

• Lead the physical design and implementation of state-of-the-art RF/mmWave ICs, including transmitter and receiver front-end blocks such as power amplifiers, low-noise amplifiers, phase shifters, variable-gain amplifiers, mixers, multipliers, VCOs, frequency synthesizers, and supporting analog/RF circuitry.
• Drive block-to-top integration, including chip-level floorplanning, power and ground planning, signal routing, ESD strategy, pad assembly, density fill, and design-for-manufacturability requirements.
• Lead compact chip-level integration approaches that optimize RF performance, isolation, area, reliability, and manufacturability.
• Perform and debug physical verification, including DRC, LVS, ERC, antenna checks, density checks, and related sign-off requirements.
• Support parasitic extraction and post-layout analysis; collaborate with circuit designers to resolve performance, coupling, EM, IR, reliability, and extraction-related issues.
• Develop layout schedules, identify implementation risks and dependencies, and deliver verified layouts aligned with program milestones and tape-out schedules.
• Prepare and release final layout databases to the foundry, including support for tape-out readiness reviews and mask database delivery.
• Lead layout reviews, define and document best practices, and mentor less-experienced layout engineers and designers.
• Coordinate layout execution across internal teams, third-party design partners, and cross-functional stakeholders across multiple locations.

Minimum Qualifications

• B.S. degree in Electrical Engineering, Electronic Engineering, Computer Engineering, or a related technical field.
• 10+ years of professional experience in RF/mmWave, analog, or mixed-signal custom IC layout and physical implementation.
• Extensive hands-on experience with high-frequency RF/mmWave IC layout in technologies such as RF CMOS, SOI, SiGe, or related advanced semiconductor processes.
• Successful completion of multiple IC product lifecycles or tape-outs, preferably including high-volume or mission-critical chipsets.
• Strong expertise in layout and integration of RF transmitter and receiver front-end circuits, including one or more full TX/RX chains.
• Direct experience laying out RF/mmWave blocks such as LNAs, PAs, mixers, VCOs, frequency synthesizers, phase shifters, VGAs, multipliers, and RF passives.
• Strong understanding of device-level layout techniques, including matching, symmetry, shielding, common-centroid layout, interdigitation, guard rings, and isolation structures.
• Strong understanding of parasitic effects, coupling mechanisms, grounding strategies, substrate noise isolation, differential routing, and RF signal integrity.
• Experience with analog building blocks such as operational amplifiers, bias generators, temperature sensors, LDOs, ADCs, DACs, and related support circuitry.