Principal Mechanical Engineer

Titus Talent Strategies; Sugar Land (TX); On-site; USD 150,000 - 210,000; Full time

Job summary

Titus Talent Strategies is seeking a highly experienced Mechanical Engineer to lead aerospace enclosure design, thermal analysis, and ruggedized packaging for advanced electronics. The role requires hands-on hardware design with a focus on survivability in extreme environments, including prototyping, testing, and material selection.

Ideal candidates will have a BS and preferably an MS in Mechanical Engineering, plus a minimum of fifteen years of experience in aerospace or defense.

Qualifications

• BS in mechanical engineering required; MS desired for advanced design focus.
• At least 15 years of hands-on mechanical design experience in aerospace/defense.
• Strong capability in designing robust enclosures and thermal/mechanical survivability.

Responsibilities

• Lead mechanical architecture and enclosure design for aerospace electronics packaging.
• Perform finite element analysis, CFD, and thermal resistance modeling.
• Guide prototyping, testing, and lab verification of mechanical hardware.
• Select materials and processes to optimize weight and strength.
• Conduct tolerance analyses to ensure fit and function in high-precision manufacturing.
• Diagnose mechanical/thermal failures and implement design fixes for flight requirements.

Skills

Mechanical design

Thermal analysis

Ruggedized packaging

Prototyping testing

Material selection

Tolerance analysis

Root cause analysis

Education

Bachelor of Science in Mechanical Engineering

Master of Science in Mechanical Engineering

Job description

Roles and Responsibilities

• Mechanical Architecture and Enclosure Design: Design robust mechanical enclosures and structural components utilizing advanced computer-aided design software for aerospace electronics packaging.
• Thermal and Structural Analysis: Conduct finite element analysis for stress, strain, and fatigue alongside computational fluid dynamics or thermal resistance modeling to ensure structural and thermal survivability.
• Ruggedized Computing Packaging: Apply advanced knowledge of shock isolation, vibration dampening, and environmental sealing to design enclosures that protect sensitive electronics from extreme external environments.
• Prototyping and Testing: Lead the physical assembly, fit checking, and laboratory testing of mechanical prototypes, including structural pull tests and thermal survey instrumentation.
• Material and Manufacturing Process Selection: Select high-performance materials, coatings, and fabrication methods such as precision machining, sheet metal fabrication, and additive manufacturing to optimize weight and strength.
• Tolerance Analysis: Perform detailed geometric dimensioning and tolerancing analyses to ensure proper fit, form, and function during high-precision manufacturing and assembly.
• Technical Root Cause Analysis: Diagnose mechanical, structural, or thermal failures during environmental testing and implement effective engineering design fixes to meet flight requirements.

Education

Academic Credentials

• Bachelor of Science in Mechanical Engineering from an accredited university or institution.
• A Master of Science in Mechanical Engineering is highly desirable, but practical hands-on hardware design history is heavily weighted.

Years of Experience

• Minimum Requirements: A minimum of fifteen years of progressive, hands-on mechanical engineering design experience directly supporting the aerospace or defense industry.

Equal Employment Opportunity Statement

Our Partner is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other characteristic protected by applicable federal, state, or local law.