Principal Field Application Engineering

GlobalFoundries; Santa Clara (CA); On-site; USD 81,000 - 131,000; Full time

Job summary

GlobalFoundries is seeking a Principal Field Application Engineer to engage with RF and Photonics customers early, assess technical needs, and drive opportunities toward tapeout. You will work cross-functionally with GF experts to propose design-winning solutions and help convert DWIN into revenue.

Required: 5+ years in semiconductor design, tapeout, and related processes; strong IC design flows knowledge; fluent English; travel up to 20% domestically and some international travel.

Qualifications

• Education – Bachelors or Masters degree in electrical engineering or equivalent.
• Experience – Minimum 5 yrs in semiconductor design, tapeout and process.
• Fluency in English Language – written & verbal.

Responsibilities

• Engage customers to understand their technical needs towards development of semiconductor IC products.
• Assess the competitive landscape and advocate GF value propositions.
• Partner with GF account managers, product marketing and technical experts to craft proposals with design-winning potential.
• Identify and resolve issues to convert DWIN into tapeout and support internal teams.

Skills

IC design flows

RF/Photonics

EDA tools

Technical PM

Communication skills

Teamwork

Education

Bachelor's or Master's in Electrical Engineering

Tools

IC design tools

EDA tools

Job description

## Principal Field Application EngineeringApplylocations: Santa Claratime type: Full timeposted on: Posted Todayjob requisition id: JR-2603144**About GlobalFoundries:**GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.**Summary of Role:**The GlobalFoundries Field Application Eng (FAE) engages with GF's RF and Photonics technology customers early to assess customer technical needs and identify the best GF technical solution to satisfy those needs driving the opportunity to DWIN and on towards tapeout. The FAE should understand and surmount any barriers of adoption the client may have for using GF technologies for their product development. FAE will work cross functionally with internal GF technical experts in pursuit of converting these opportunities to revenue.**Essential Responsibilities:*** Engage customers to understand their technical needs towards the development of their semiconductor IC products.* Assess the competitive landscape to identify and advocate winning GF value propositions.* Partner internally with GF account managers, product marketing, and technical experts in the creation of compelling, application specific presentations to describe how GF technology solutions can help those customers develop their industry winning products.* Work closely with the account management team to merge technical and commercial terms into a design-winning proposal.* Identify and resolve all issues / concerns to convert the DWIN into product Tapeout.* Where competitive gaps exist, advocate internally for improved features and capabilities of GF solutions to close such gaps.**Other Responsibilities:*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.**Required Qualifications:*** Education – Bachelors or Masters degree in electrical engineering or equivalent (e.g. applied physics, etc).* Experience – Minimum 5 yrs in semiconductor design, tapeout and process.* Skills – Working knowledge of IC chip design flows and tools from architectural definition through performance characterization for RF and Photonics technologies. Technical Program Management, active thinking, positive attitude, problem solving, strong responsibility and ownership, teamwork and personal communication skills are critical.* Travel - Up to 20%, primarily domestic with some international travel.* Fluency in English Language – written & verbal**Preferred Qualifications:*** Education – Master’s or PhD in electrical engineering or equivalent.* Experience – 5 yrs in semiconductor product design at the chip or module level.* Skills - Direct experience in IC chip design flows and EDA tools from architectural definition through performance characterization. Exposure/Experience in one or more of Digital / Analog Mixed Signal/HV Power/eNVM/Millimetre Wave/Silicon Photonics IC product design highly desirable. SoC product integration/design experiences highly desirable.* Demonstrated expertise in business development within the Defense Industrial Base or related government agencies* Project management skills - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.* Strong written and verbal communication skills.* Strong planning & organizational skills.**Expected Salary Range**$81,000.00 - $131,000.00The exact Salary will be determined based on qualifications, experience and location.If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.