Principal Engineer – Wafer Fabrication

Nokia; Sunnyvale (CA); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Corporate Retirement Savings Plan

Health and dental benefits

Paid time off for holidays and vacation

Employee Stock Purchase Plan

Tuition Assistance Plan

Life insurance and AD&D – Company paid 2x base pay

Job summary

Nokia is seeking a skilled individual for a Photolithography Process Engineering role in Sunnyvale, CA. The job focuses on team leadership and optimizing processes in both existing and new fabs. Candidates should possess strong leadership skills, with a background in semiconductor fabrication and a relevant degree. Key responsibilities include process development, qualification, and troubleshooting for effective 24x7 operations. Competitive corporate benefits, including a retirement savings plan, health benefits, and tuition assistance, are offered.

Qualifications

• 5+ years of experience needed for BS, or 3+ years for MS.
• Experience supporting a 24x7 fab operations team required.
• Ability to write and train fab procedures essential.

Responsibilities

• Lead process engineering for photolithography.
• Support 24x7 operations and process development.
• Troubleshoot process problems to ensure smooth production.

Skills

JMP

DOE

SPC

Working knowledge of semiconductor fabrication processes

Strong leadership and communication skills

Experience with semiconductor process development

Education

BS with 5 years’ experience or MS with 3 years’ experience

Job description

Overview

Job Description Team leadership for photolithography process engineering. Focus areas include process sustaining for the 24x7 operation, development, qualification, and release of improved photo-lithography processes on both existing and new technology generations.

Responsibilities

• Support the execution of a steep wafer volume and yield roadmap in the existing manufacturing wafer fab (Fab1).
• Team leadership related to process qualification and implementation in a new fab focusing on larger wafer sizes (Fab2).
• Participate in various cross functional teams as a technical content expert.
• Optimize coat, exposure and develop processes related to Indium Phosphide (InP) based Photonic Integrated Circuit (PIC) wafer fabrication. Develop and implement processes with improved process capability in both Fab1 and Fab2.
• Develop and deploy control plans to keep photo-lithography processes operating within performance parameters.
• Troubleshoot photo-lithography process problems and drive details of improvement project execution to enable a smooth flow of production and development wafers.
• Execute process development and lithography roadmap activities needed for future PIC technology.
• Participate in various cross functional teams consisting of equipment, process, and integration engineers to improve process capability, wafer yields, simplify procedures and processes, and release new tools and processes with improved capacity and capability.
• Maximize the opportunity to adopt semiconductor industry best practices for Fab2 including automation of wafer and reticle handling and releasing more modern manufacturing tools for PIC wafers with variable topography.
• Lead team members partnering with the PIC R&D team to enable the development and qualification of new processes required to deliver next generation high-performance multi-Tb PICs.

Key Skills And Experience

• JMP, DOE, SPC
• Working knowledge of semiconductor fabrication processes, and specific expertise in photo-lithography.
• Strong leadership and communication skills.
• Experience with semiconductor process development, sustaining, new process introduction, and ramp to volume.
• Experience supporting a 24x7 fab operations team, writing and training of fab procedures, root cause analysis and problem resolution.

Education/Experience Required

BS with 5 years’ experience, or MS with 3 years’ experience.

About Us

Advancing connectivity to secure a brighter world. Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. Learn more about life at Nokia.

Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

About The Team

Some of our benefits in US :

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short-term disability, and long-term disability
• Life insurance, and AD&D – Company paid 2x base pay
• Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
• Paid time off for holidays and Vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.

Disclaimer for US/Canada

Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.

All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.