Principal Electrical Engineer - Defense Systems Architect

SAIC; Huntsville (AL); On-site; USD 120,000 - 180,000; Full time

Job summary

SAIC is seeking a Principal Electrical Engineer to join a team delivering hardware and software solutions for US Army programs at Redstone Arsenal, Huntsville, AL. The role focuses on translating electrical/electronic requirements into system architectures, hardware, and firmware for mission-critical weapons systems.

Responsibilities include power budgeting, circuit design for high availability, DVT leadership, and Technical Data Package creation.

Qualifications

• BS in Electrical / Computer Engineering; nine years' experience, or six years with no degree.
• Embedded MCU hardware/firmware design experience preferred.
• Experience with MIL-STD-461 EMC/EMI and high-reliability SWAP environments.

Responsibilities

• Perform power budget analysis for fixed and mounted computing environments.
• Design, analyze, simulate, and select components for high reliability SWAP.
• Direct design verification testing of prototype hardware/firmware.
• Prepare Technical Data Package (TDP) documentation.
• Assess risks and mitigations; review test plans and procedures.
• Review Deficiency Reports and Milestone deliverables.
• Participate in internal peer reviews and customer design reviews.
• Mentor junior engineers.

Skills

Embedded firmware

FPGA design

High-speed digital

Analog design

Power electronics

Motor control

EMC/EMI

MBSE

Altium Designer

PSpice

Education

BS in Electrical or Computer Engineering

Tools

Altium Designer

PSpice

MS Office

MS Visio

Job description

SAIC is seeking a Principal Electrical Engineer to join a team delivering hardware and software solutions for US Army programs at Redstone Arsenal, Huntsville, AL. The role focuses on translating electrical/electronic requirements into system architectures, hardware, and firmware for mission-critical weapons systems.

Responsibilities include power budgeting, circuit design for high availability, DVT leadership, and Technical Data Package creation.