Precision Wafer Separation Technician

Keysight Technologies SAles Spain SL.; Santa Rosa, Northern (CA, KY); Hybrid; USD 56,000 - 93,000; Full time

Job summary

Keysight Technologies SAles Spain SL. in Santa Rosa, CA is seeking a detail-oriented Separation Operator in the Die Fab department to perform delicate wafer separation and cleaning on 3-inch and 200mm wafers, following engineering specs and safety protocols.

You will work with engineers, area trainers, and operators, maintaining independence while supporting production goals in a cleanroom environment and adhering to ESD procedures.

Qualifications

• Strong attention to detail and manual dexterity for handling fragile components.
• Ability to work independently while maintaining alignment with team objectives.
• Willingness to learn and grow within a high-tech manufacturing environment.
• Experience in cleanroom or semiconductor manufacturing is a plus.
• Experience with Microsoft applications.
• Strong verbal and written communication skills.
• Able to work in a cross-functional environment collaboratively with other departments.

Responsibilities

• Perform delicate handling and processing of wafers according to detailed product documentation and engineering specifications.
• Mount wafers on specialized tape and apply chemical layers in preparation for separation.
• Operate precision equipment including ultra-thin diamond blade cutters and laser separation systems.
• Follow standardized procedures and strict safety protocols to ensure consistent quality and reliability.
• Contribute to continuous improvement by learning new skills and adapting to evolving processes.
• Able to work in an ESD environment and follow all ESD protocols

Skills

Attention to detail

Manual dexterity

Independent work

Willingness to learn

Cross-functional collaboration

Verbal and written communication

Semiconductor manufacturing experience

Tools

Microsoft applications

Job description

Keysight Technologies SAles Spain SL. in Santa Rosa, CA is seeking a detail-oriented Separation Operator in the Die Fab department to perform delicate wafer separation and cleaning on 3-inch and 200mm wafers, following engineering specs and safety protocols.

You will work with engineers, area trainers, and operators, maintaining independence while supporting production goals in a cleanroom environment and adhering to ESD procedures.