Precision PCB Repair Technician – BGA & Growth Benefits

Foxconn WI; Mount Pleasant (WI); On-site; USD 55,000 - 75,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

Basic life insurance and short-term (d

Supplemental life and long-term-disab

401K with employer contribution

Paid time off (PTO)

Onsite Health & Wellness Center

Learning and growth in smartmanufactur

Job summary

FII USA, Inc., a Foxconn Technology Group company, seeks an Advanced Repair Technician to perform expert BGA and high-density board repairs in a precision repair environment.

You will diagnose complex PCB failures, solder and de-solder fine-pitch components, operate ERSA/SUMMIT rework systems, interpret schematics, and mentor junior technicians while upholding IPC standards. This full-time role offers benefits and growth opportunities.

Qualifications

• Requires a 2-year technical degree or equivalent experience in advanced electronics repair.
• Extensive experience with BGA and fine-pitch component repair.
• Proficiency with IPC-A-610, IPC-7711/7721, and J-STD-001 standards.
• Experience with BGA rework tools and thermal profiling techniques.
• Ability to mentor peers and document repairs accurately.

Responsibilities

• Perform advanced diagnostics and root cause analysis on complex PCB failures.
• Execute expert-level soldering and de-soldering, including BGA, SMT, and fine-pitch components.
• Operate high-end rework equipment, including BGA Rework Stations (ERSA, SUMMIT, etc.).
• Interpret and work from circuit schematics and engineering documentation.
• Maintain detailed records of repair actions and results for traceability.
• Train junior technicians on advanced repair methods and standards.
• Ensure compliance with IPC-7711/21 and quality management systems.
• Support process improvement initiatives within the repair department.
• Other duties as assigned.

Skills

BGA repair

Fine-pitch repair

Troubleshooting

Documentation

Mentoring

Education

2-year technical degree or equivalent experience

Tools

ERSA rework system

SUMMIT rework system

Thermal profiling

Job description

FII USA, Inc., a Foxconn Technology Group company, seeks an Advanced Repair Technician to perform expert BGA and high-density board repairs in a precision repair environment.

You will diagnose complex PCB failures, solder and de-solder fine-pitch components, operate ERSA/SUMMIT rework systems, interpret schematics, and mentor junior technicians while upholding IPC standards. This full-time role offers benefits and growth opportunities.