Plating Manufacturing Technician (52907)

Headway Technologies; Milpitas (CA); On-site; USD 29,000 - 43,000; Full time

Benefits offered by this job

Bonus target

Benefits

Job summary

Headway Technologies in Milpitas, CA is seeking a Plating Manufacturing Engineer Technician to support plating operations and wafer fab production. You will review processes, document procedures, and help drive continuous improvement using SPC data and corrective actions.

The role is based in Milpitas with a D-shift schedule and full-time employment. Applicants should have an Associate degree and 2+ years in semiconductor manufacturing, plus proficiency with MS Office and plating tools.

Qualifications

• Associates degree in Electronics, Industrial Engineering, or Manufacturing Technology and/or equivalent experience.
• Two years in semiconductor high-volume manufacturing.
• Strong knowledge of electronics and manufacturing processes.

Responsibilities

• Support plating manufacturing and engineering teams in the plating area.
• Assist wafer fab production and processes for efficient, cost-effective wafer processing.
• Review and document processes; implement changes with engineering to minimize disruption, and provide data-driven corrective actions.

Skills

MS Office

Electronics

Manufacturing

Education

Associate degree

Tools

Plating tools

Wet etch equipment

Job description

Job Details

Job Location: Bldg 5 - Milpitas, CA, Position Type: Full Time, Education Level: 2 Year Degree, Salary Range: $20.00 - $31.35Hourly, Job Shift: D Shift: F-Sun e/o Th 6:00 PM-6:00 AM, TITLE: PLATING ME TECHNICIAN

D SHIFT: FRIDAY THRU SUNDAY AND EVERY OTHER THURSDAY 6:00 PM TO 6:00 AM

Reports to

SR. MANAGER, PLATING MANUFACTURING ENGINEERING

Summary

Under the direction of the Sr. Manager of Plating Manufacturing Engineering, the Plating ME Technician provides support to the manufacturing and engineering teams in the plating area, assists and supports wafer fab production, reviews and documents processes or procedures, and dispositions abnormal wafers for rework; maintains process controls using Statistical Process Control (SPC), collects and analyzes data, and recommends corrective action; supports activities related to improved manufacturing efficiency This position is located in Milpitas, California.

Essential Functions

• Provides support to the manufacturing and engineering teams in the plating area
• Supports wafer fab production and manufacturing processes to ensure that wafers are processed efficiently and cost effectively
• Reviews and documents processes and procedures; partners with engineering to implement changes effectively and with minimal disruption
• Dispositions abnormal or atypical wafers for rework; ensures that rework is completed promptly
• Collects and analyzes data and recommends corrective action if required
• Reviews and maintains process controls using SPC and prepares charts and graphs as needed
• Assists with trouble-shooting tools and process issues in the plating area
• Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives
• Assists with training and certifying operators on various tools and manufacturing processes
• Collaborates with manufacturing or engineering to qualify or approve new processes or procedures and may assist with identifying production integration timelines
• Responds to inquiries from other team members, managers, or departments
• Overtime may be required contingent on business needs
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

Minimum Qualifications

• Associates degree in Electronics, Industrial Engineering, or Manufacturing Technology and/or equivalent relevant experience
• Two years of experience working in the semiconductor industry in a high volume manufacturing environment
• Strong knowledge of electronics and manufacturing processes
• Proficient in the use of Microsoft Office Applications

Required Knowledge, Skills, and Abilities

• Knowledge and ability to use various types of plating tools or wet etch equipment
• Knowledge of the semiconductor and hard disk drive industry principles, practices, and techniques
• Knowledge of and ability to use MS Office, including Word, Excel, Power Point, and Access to analyze data, create documents, spreadsheets, and presentations
• Knowledge and ability to use SPC to maintain process controls
• Ability to collect and analyze data using SPC, including presenting findings and recommending corrective action
• Ability to troubleshoot various types of tools and tool sets to ensure minimal downtime
• Ability to adhere to all safety policies and procedures
• Ability to communicate, both verbally and in writing, with contractors, consultants, employees, management, and vendors
• Demonstrated ability to problem solve
• Skilled at time management
• Skilled at resolving issues quickly and efficiently
• Flexible and able to prioritize

The hourly rate for this full-time position is between $20.90-$31.35 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.

Working Conditions

The Plating ME Technician works primarily in an indoor environment on a rotating schedule on D shift Friday thru Sunday and every other Thursday 6:00 PM to 6:00 AM. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds.

*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.