PIC Packager

Darwin Recruitment; California; On-site; USD 90,000 - 135,000; Full time

Job summary

Darwin Recruitment is seeking a PIC Packager Engineer to develop packaging for photonic devices, collaborating with design, process, test and manufacturing teams to move from prototype to volume production. You will optimize optical performance, reliability and manufacturability.

The role requires strong background in photonics packaging, optical alignment and thermal management, plus experience with semiconductor packaging processes and external vendors.

Qualifications

• Several years of experience developing packaging solutions for photonic or optoelectronic devices.
• Strong understanding of optical alignment, fibre coupling and photonic assembly techniques.
• Experience with semiconductor packaging processes including die attach, wire bonding, flip-chip or advanced packaging technologies.
• Knowledge of thermal management and reliability considerations for optical devices.
• Experience working with external packaging vendors or contract manufacturers.
• Strong analytical and problem-solving skills within cross-functional engineering environments.

Responsibilities

• Design and develop packaging solutions for photonic integrated circuits and optical modules.
• Define assembly processes including fibre attach, optical alignment, die bonding, flip-chip integration and electrical interconnects.
• Work with internal and external manufacturing partners to support prototype builds and production scaling.
• Develop packaging architectures that optimise optical performance, thermal management and long-term reliability.
• Support package qualification through environmental, thermal and reliability testing.
• Collaborate with PIC designers, process engineers and test teams to resolve integration challenges.
• Drive continuous improvements in packaging processes, yield and manufacturing efficiency.

Skills

Photonic packaging

Optical alignment

Fiber coupling

Semiconductor packaging

Thermal management

Cross-functional collaboration

Education

Bachelor's degree in Photonics or related

Master's or PhD preferred

Tools

FEA

Thermal simulation

Python or MATLAB

Job description

PIC Packager

The Role

As a Photonic Integrated Circuit (PIC) Packaging Engineer, you'll play a critical role in developing advanced packaging solutions for silicon photonic devices. Working closely with design, process, test and manufacturing teams, you'll help take products from prototype through qualification and volume production, ensuring high performance, reliability and manufacturability.

What You'll Do

• Design and develop packaging solutions for photonic integrated circuits and optical modules.
• Define assembly processes including fibre attach, optical alignment, die bonding, flip-chip integration and electrical interconnects.
• Work with internal and external manufacturing partners to support prototype builds and production scaling.
• Develop packaging architectures that optimise optical performance, thermal management and long-term reliability.
• Support package qualification through environmental, thermal and reliability testing.
• Collaborate with PIC designers, process engineers and test teams to resolve integration challenges.
• Drive continuous improvements in packaging processes, yield and manufacturing efficiency.

What We're Looking For

• Bachelor's, Master's or PhD in Photonics, Electrical Engineering, Mechanical Engineering, Materials Science or a related discipline.
• Several years of experience developing packaging solutions for photonic or optoelectronic devices.
• Strong understanding of optical alignment, fibre coupling and photonic assembly techniques.
• Experience with semiconductor packaging processes including die attach, wire bonding, flip-chip or advanced packaging technologies.
• Knowledge of thermal management, mechanical design and reliability considerations for optical devices.
• Experience working with external packaging vendors or contract manufacturers.
• Strong analytical and problem-solving skills within cross-functional engineering environments.

Nice to Have

• Experience packaging silicon photonics, co-packaged optics or optical interconnect products.
• Knowledge of fibre-array attachment, passive and active alignment techniques.
• Familiarity with automated assembly equipment and process development.
• Experience with finite element analysis (FEA), thermal simulation or optical tolerance analysis.
• Python or MATLAB experience for data analysis and process optimisation.