Photolithography Wafer Process Internship (Summer 2027)

Seagate Technology

BLOOMINGTON (MN)

On-site

USD 37,000 - 43,000

Part time

4 days ago
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Benefits offered by this job

Medical, dental, vision insurance
Employee Stock Purchase Plan
12 paid holidays
Minimum 48 hours paid sick leave

Job summary

Seagate is seeking a Wafer Photo Process Engineering Intern for Summer 2027 in Bloomington, MN. You will work with photolithography tools, conduct trials in a cleanroom, and analyze data to support process improvements for recording head products.

Ideal candidates are pursuing engineering or materials science degrees, with exposure to data analysis tools (MATLAB, R, Excel, JMP, Python) and strong communication. The role includes on-site facilities and a structured internship program.

Qualifications

  • Completed at least two years of an undergraduate degree in Engineering or Material Science.
  • Enrolled in Fall 2027 classes.
  • Interest in nano-fabrication processes/operations.
  • Statistics and Data Analysis experience using MatLab, R, Excel, JMP or Python.
  • Strong communication skills and self-motivation.

Responsibilities

  • Develop technical understanding of Photolithography process tools and responses.
  • Perform process trials in a cleanroom to test product trials and improvements.
  • Utilize software tools for data analysis and presentation to engineers.

Skills

Data analysis
Communication skills
Motivated / self-directed

Education

Engineering
Materials Science

Tools

MATLAB
R
Excel
JMP
Python

Job description

Seagate is seeking a Wafer Photo Process Engineering Intern for Summer 2027 in Bloomington, MN. You will work with photolithography tools, conduct trials in a cleanroom, and analyze data to support process improvements for recording head products.

Ideal candidates are pursuing engineering or materials science degrees, with exposure to data analysis tools (MATLAB, R, Excel, JMP, Python) and strong communication. The role includes on-site facilities and a structured internship program.

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