PCB Design Engineer II - High Reliability Embedded

Gentex Corporation; United States; On-site; USD 85,000 - 110,000; Full time

Job summary

Gentex Corporation is seeking a PCB Design Engineer II to perform printed circuit board design for new products. The role blends technical PCB layout expertise with documentation, problem solving, and collaboration within hardware development teams.

On-site work at Gentex facilities is required. You will design, route, and optimize high-density PCBs using Xpedition, OrCAD, or Altium, ensuring signal integrity, power integrity, and thermal management for automotive applications.

Qualifications

• Bachelor’s degree in Electrical or Computer Engineering or closely related field.
• 2+ years of relevant professional experience.

Responsibilities

• Design and launch new PCB products within a cross-functional hardware team.
• Apply expertise in lamination, imaging, etching, drilling for reliable high-volume PCB designs.
• Use EDA tools to develop PCB layouts for embedded applications.
• Place and route high-density multi-layer PCBs (rigid, rigid-flex, flex, HDI) focusing on signal, power, and thermal integrity.
• Collaborate with Mechanical and Electrical Engineers to optimize packaging and integration.
• Coordinate design reviews and ensure manufacturability and testability of layouts.
• Interface with PCBA manufacturing, Purchasing, and PCB vendors to optimize costs and guidelines.
• Stay current with industry trends to drive continuous improvement.

Skills

PCB design

Electrical engineering

Automotive knowledge

Education

Bachelor’s degree in Electrical or Computer Engineering

Tools

Xpedition

OrCAD

Altium

Job description

Gentex Corporation is seeking a PCB Design Engineer II to perform printed circuit board design for new products. The role blends technical PCB layout expertise with documentation, problem solving, and collaboration within hardware development teams.

On-site work at Gentex facilities is required. You will design, route, and optimize high-density PCBs using Xpedition, OrCAD, or Altium, ensuring signal integrity, power integrity, and thermal management for automotive applications.