PCB Design Engineer

Pentangle Tech Services | P5 Group; Peoria (IL); On-site; USD 65,000 - 105,000; Full time

Job summary

Pentangle Tech Services | P5 Group is seeking a PCB Design Engineer to contribute to schematics, PCB layouts, and library designs using Mentor Graphics and Altium. The role emphasizes EMC/HDI considerations, via structures, and adherence to IPC standards.

The candidate will collaborate with fabrication vendors, ensure Gerber releases are accurate, and support multi-layer, blind/buried via designs for high-density assemblies.

Qualifications

• PCB design engineer with experience in Schematic Capture and PCB Layout using Mentor Graphics, Altium, etc.
• Component library design experience.
• EMC design considerations for high-density analog/mixed-signal and RF routing.
• Design for mechanical constraints and customer-specific constraints and IPC PCB design standards.
• DFM and DFT and Gerber release for PCB fabrication and assembly.
• Designing multilayer high-density interconnect PCBs with via structures up to 12 layers.
• Design of multi-layer, blind and buried vias and sub-0.5 mm pitch applications.
• Coordinate with PCB fabrication and assembly vendors.
• IPC-A-600 for design and ASME/ANSI for documentation.

Skills

PCB design

Schematic Capture

PCB Layout

RF routing

Analog & mixed-signal design

EMC design

HDI/High density design

DFM/DFT

IPC design standards

Vendor coordination

Via structures (12+ layers)

Tools

Mentor Graphics

Altium

Job description

• PCB design engineer with expeirence in Schematic Capture and PCB Layout using multiple tools Mentor graphics, Altium, etc
• Component library design experiences
• EMC design consideration, High desity design, Analog and mixed signal, RF signal routing expereince.
• Design for Mechanical contraints and customer specific design contraints and IPC PCB design standards
• DMF and DFT and gerber release for PCB fabrication and assembly.
• Designing multilayer high-density interconnect printed circuits with multiple via structures up to 12 layers.
• Design of multi-lam, blind and buried via, and sub .5mm pitch applications.
• Coordinate with PCB fabrication and assembly assembly vendors
• IPC-A-600 for design and ASME/ANSI for documentation.