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HP, Inc. invites applicants to join a 12-week paid summer internship across multiple engineering tracks. This pipeline requisition targets candidates for 2027 internships with potential conversion to a full-time role based on performance and headcount. You must be eligible to work in the US in 2027 without sponsorship in the future.
Programs span Quality, Mechanical, Electrical, Firmware, Software, Cybersecurity, Data Science, and more. Emphasis on hands-on projects and cross-functional teamwork.
HP, Inc. invites applicants to join a 12-week paid summer internship across multiple engineering tracks. This pipeline requisition targets candidates for 2027 internships with potential conversion to a full-time role based on performance and headcount. You must be eligible to work in the US in 2027 without sponsorship in the future.
Programs span Quality, Mechanical, Electrical, Firmware, Software, Cybersecurity, Data Science, and more. Emphasis on hands-on projects and cross-functional teamwork.