Packaging Thermal Technologist

AMD; Austin (TX); On-site; USD 140,000 - 210,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

AMD Austin is seeking a Package-centric Thermal Modeling Architect to define and drive next-generation packaging-platform architectures through model-based decision making and STCO. You will develop, validate, and apply thermal models to guide SoC, package, and board-level architecture and the integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

The ideal candidate is a self-directed technical leader who collaborates across silicon,

Qualifications

• Model-based architecture and design decisions across SoC, package and system-level thermal modeling.
• Strong background in thermal and CFD first-principles understanding for multi-physics trade-offs.
• Experience with advanced PCB technologies and SMT processes; cross-functional collaboration.

Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain thermal and multi-physics models and drive validation strategies with labs to enable STCO across silicon, package, board and platform.
• Engage with suppliers, partners, and vendors to align material properties and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for thermal and package technology development and influence product roadmaps.
• Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a focus on data center platforms.

Skills

Model-based architecture

Thermal and multi-physics modeling

SoC/package/system-level design

STCO (System-Technology Co-Optimizati)

Leadership and collaboration across-te

Education

MS or PhD in Engineering or Physics

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

The Role

In this role, you will serve as a Package-centric Thermal Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply thermal models to guide SoC/package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

The Person

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for STCO-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

Key Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
• Engage with suppliers, partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for thermal and package technology development, assess technology readiness, and influence product roadmaps.
• Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a primary focus on data center platforms.

Preferred Experience

• Demonstrated experience owning and driving model-based architecture & design decisions, supported by SoC, package, and system-level thermal modeling, characterization and validation.
• Solid foundation in Thermal and CFD first-principles understanding and multi-physics SoC-package-system-level design & assembly trade-offs.
• Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
• Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
• Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
• Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.

Academic Credentials

MS or PhD in relevant Engineering disciplines or physics.

LOCATION:

Austin, Texas

Benefits offered are described: AMD benefits at a glance.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.