Packaging Engineer: Lifecycle & Process Optimization

Hikma Pharmaceuticals

Columbus (OH)

On-site

USD 70,000 - 100,000

Full time

14 days+

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Benefits offered by this job

Annual performance bonus
401(k) matching
Paid time off
Personal days
Health benefits
Employee discount program
Wellbeing rewards programme
Tuition reimbursement
Parental leave

Job summary

Hikma Pharmaceuticals USA Inc. in Columbus, OH is seeking an Engineer, Packaging to join our team.

You will be responsible for managing lifecycle processes for packaging components, troubleshooting, and optimizing packaging lines to improve safety, quality, and efficiency. Under guidance from senior engineers, you will develop packaging specifications, prepare line trial protocols, and document master data, ensuring compliance with cGMP, FDA, and regulatory requirements while collaborating with

Qualifications

  • B.S. degree in Packaging Engineering, Industrial Engineering, or related discipline.
  • Alternative higher degrees or related experience may be considered.

Responsibilities

  • Manages lifecycle processes for packaging components and oversees troubleshooting and optimization on packaging lines.
  • Develops packaging material specifications and prepares line trial protocols and master data.
  • Documents packaging specifications and ensures compliance with regulatory guidelines (cGMP, FDA).

Education

B.S. degree in Packaging Engineering
Alternatively, higher degrees or additional related experience

Job description

Hikma Pharmaceuticals USA Inc. in Columbus, OH is seeking an Engineer, Packaging to join our team.

You will be responsible for managing lifecycle processes for packaging components, troubleshooting, and optimizing packaging lines to improve safety, quality, and efficiency. Under guidance from senior engineers, you will develop packaging specifications, prepare line trial protocols, and document master data, ensuring compliance with cGMP, FDA, and regulatory requirements while collaborating with

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