Package Development, Signal Integrity and Power Integrity Engineer, Staff

Marvell Semiconductor, Inc.; California, Santa Clara (MO, CA); On-site; USD 105,000 - 158,000; Full time

Job summary

An innovative firm is seeking a talented High-speed IC package development engineer to shape the future of microelectronics. This role involves developing advanced packages supporting data rates of 448 Gb/s and beyond, ensuring signal integrity, and collaborating with cross-functional teams. You'll leverage your expertise in electromagnetic theory and simulation tools to drive layout and manufacturability while contributing to cutting-edge technology development. If you're passionate about impactful innovation and thrive in a collaborative environment, this is the opportunity for you.

Benefits

Flexible Time Off

401k

Health Benefits

Equity

Comprehensive Bonus Package

Qualifications

• 5-8 years of experience in semiconductor packaging.
• Strong skills in electromagnetic theory and transmission lines.
• Experience with 2.5D/3D package development is a plus.

Responsibilities

• Develop advanced microelectronic packages for high-speed data rates.
• Collaborate with suppliers and internal teams for package technology.
• Ensure manufacturability and compliance with performance standards.

Skills

Electromagnetic Theory

Transmission Lines

Microwave Theory

2-D and 3-D EM Simulation Tools

Cross-functional Team Management

IC Package Layout Tools

Scripting Tools (Python)

Circuit Design Tools

High-speed Signaling

Debugging EMI/EMC Problems

Education

Bachelor's in Computer Science or Electrical Engineering

Master's/PhD in related fields

Tools

Ansys HFSS

SI-Wave

Cadence Clarity

APD

PADS

Spectre

ADS

HSpice

PowerSI

SIwave

Job description

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Marvell's Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. Collaboration with marketing and IC designers to develop achievable package specifications and contribute to new package technology development is also essential.

What You Can Expect

As part of our team, you'll work on cutting-edge microelectronic packages supporting data rates of 448 Gb/s and beyond. Your responsibilities include package development, electrical design, modeling, and characterization, ensuring signal and power integrity while considering manufacturing tolerances. You'll collaborate with suppliers and internal teams to select and develop package technology, drive layout, and ensure manufacturability and compliance with performance standards.

What We're Looking For

• Bachelor's degree in Computer Science, Electrical Engineering, or related fields with 5-8 years of experience, or Master's/PhD with 1-3 years of experience.
• Strong fundamentals in electromagnetic theory, transmission lines, and microwave theory.
• Experience with 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity.
• Ability to manage package development involving cross-functional teams.
• Familiarity with IC package layout tools like APD or PADS.
• Experience with 2.5D/3D package development is highly desired.
• Proficiency in scripting tools like Python for automating SI, PI, and packaging activities.
• Knowledge of circuit design tools such as Spectre, ADS, HSpice.
• Experience with VNA and TDR measurements for package and PCB characterization.
• Understanding high-speed signaling in frequency and time domains.
• Experience with electronic packaging for digital and analog ICs.
• Power plane design and analysis using tools like PowerSI, SIwave.
• Knowledge of packaging technologies, materials, and assembly rules.
• Ability to debug and simulate EMI/EMC problems.
• Experience with new product introduction from concept to production is a plus.
• Understanding thermal and mechanical analysis of IC packages is a plus.
• Experience with channel simulations using MATLAB, ADS, or other tools is a plus.
• A team player with strong communication, presentation, and documentation skills.

Compensation and Benefits

The base pay range is $105,470 - $158,000 annually, determined by skills, experience, and location. We offer a comprehensive package including bonus, equity, health and financial benefits, flexible time off, 401k, and more. All qualified applicants will receive consideration without discrimination. For accommodations, contact [e-mail].