Package Development Engineer

onsemi; San Jose (CA); On-site; USD 150,000 - 250,000; Full time

Job summary

onsemi is seeking a senior packaging lead to develop and qualify advanced multi-Phase Power Modules, DrMOS, and SPS packages. You will own architecture, substrate design, flip-chip integration, and reliability qualification, collaborating with Product Engineering, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.

Responsibilities span from concept through production release, including process flow, stack-up optimization, thermal

Qualifications

• BS/MS in Electrical Engineering or related field.
• 10+ years of semiconductor package development experience.
• Expertise in multi-phase power modules, DrMOS, and SPS packaging.
• Experience with OSATs, substrates, and vendors.
• Strong communication and cross-functional collaboration.
• Proficiency with ACAD, 8D, SPC, DFMEA, DOE.

Responsibilities

• Lead package development from concept to production release.
• Define architecture, materials, and assembly flow.
• Design substrate stack-up, routing, and thermal features.
• Drive flip-chip integration and bump design.
• Plan passive component integration.
• Optimize electrical, thermal, and mechanical performance.
• Lead package qualification and reliability testing per JEDEC and IPC.
• Conduct root-cause analysis and implement corrective actions.
• Collaborate with OSATs, suppliers on DFM, yields, and cost reductions.
• Support NPI and transfer to high-volume manufacturing.

Skills

Power Packaging

DrMOS

SPS Packaging

Substrate Design

Flip-chip Assembly

Passive Components

Thermal Management

Reliability Engineering

NPI Processes

OSAT Collaboration

High-volume Manufacturing

ACAD

Education

BS/MS in Electrical Engineering or related field

Tools

8D

SPC

DFMEA

DOE

ACAD

Job description

Job Description

Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.

Responsibilities

• Lead package development from concept through production release.
• Define package architecture, materials selection, and assembly process flow.
• Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
• Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
• Develop passive component integration strategies for capacitors, resistors, and magnetic components.
• Perform electrical, thermal, and mechanical performance optimization.
• Lead package qualification and reliability testing per JEDEC and IPC standards.
• Conduct root cause analysis and implement corrective actions for package failures.
• Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
• Support NPI execution and transfer technologies into high-volume manufacturing.

Qualifications

• BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 10+ years of semiconductor package development experience.
• Strong expertise in:
• Multi-Phase Power Modules, DrMOS, and SPS packaging
• Advanced substrate design and manufacturing
• Flip-chip assembly and package integration
• Passive component assembly and optimization
• Thermal management and reliability engineering
• High-volume manufacturing and NPI processes
• Experience working with OSATs, substrate suppliers, and material vendors.
• Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
• Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
• Proven ability to lead projects across organizations and cultures in a fast-paced environment.

onsemi is excited to share the base salary range for this position is $150,000.00 to $249,780.00. The Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [e-mail] for assistance.