Package Design & Substrate Engineer

Touchdown Labs, Inc.; Santa Clara (CA); Híbrido; USD 150.000 - 200.000; Jornada completa

Descripción de la vacante

Touchdown Labs is seeking a Package Design & Substrate Engineer to drive substrate stack-up, routing, and thermal integrity for high-speed compute chips. You will work closely with chip, system, and supplier teams to ensure robust packaging and testability in a fast-paced environment.

The role requires 7+ years in package/substrate design, SI/PI and thermal simulation experience, and proficiency with Cadence APD/SiP or Ansys.

Formación

• Must have 7+ years in package or substrate design.
• Experience with SI/PI and thermal simulation.
• Proficiency with Cadence APD/SiP or Ansys tools.
• Ability to collaborate with chip, system, and supplier engineers.

Responsabilidades

• Own substrate and interposer stack-up.
• Perform signal, power, and thermal checks.
• Publish design rules for integration and test.

Conocimientos

Package design

Substrate design

Signal integrity

Thermal analysis

Herramientas

Cadence APD/SiP

Ansys

Descripción del empleo

# Package Design & Substrate EngineerDesign packages and substrates that can be built, tested, and cooled.**Location:** Hsinchu, Taiwan · Santa Clara, CAAll roles →Apply for this role →---SeniorHsinchuSanta ClaraOpenings: 1–2Open role## Package Design & Substrate Engineer### Our missionAI is becoming fundamental to how the world works. When it is, the ability to compute, and to manufacture the hardware that computes, should not be concentrated in a few places. Touchdown's mission is to make compute accessible to the whole world and to reindustrialize advanced semiconductor manufacturing in the United States. We co-design everything for next-generation compute: the AI systems people use, the software that serves them, the architectures and chips underneath, and the packaging, test, and manufacturing that make them real. Co-design brings down the complexity and cost of building compute. That is what makes manufacturing in America competitive again, and what puts compute within reach of people and companies everywhere. We build alongside the world's best manufacturing ecosystems, including Taiwan's, and every role here makes one layer better and carries what it learns to the rest.### Why this role mattersThe package is a circuit, a thermal path, and a mechanical structure at once. Designing it alongside the chip and system is one of the clearest wins of co-design.### Technical scopeSubstrate and interposer stack-up; routing for high-speed and high-bandwidth interfaces; signal and power integrity; thermal design and simulation; mechanical stress and warpage; design-for-assembly and design-for-test rules; working with chip, system, and supplier engineers.### First 90 days* Take ownership of package design reviews.* Run signal, power, and thermal checks.* Publish design rules for integration and test.### What you will own* Substrate and interposer stack-up.* Signal, power, and thermal integrity.* Design-for-assembly and design-for-test rules.### What you bring* 7+ years in package or substrate design.* SI/PI and thermal simulation tools.* Has designed packages or substrates for high-speed or high-power devices.* Uses tools such as Cadence APD/SiP, Ansys, or equivalents.### Helpful experience* Mandarin### How we work* AI-native by default. You use coding agents, AI-assisted analysis, and automation every day, and you check their output against measurements before anyone relies on it.* We work alongside foundries, test houses, OSATs, and research labs, and we build with partners rather than against them.* Touchdown does not operate a production fab today.* Do not bring, send, or use confidential information or trade secrets from a current or former employer. We hire for skill and judgment, not for anyone else's process recipes.### How the role works* Full-time.* Location: Hsinchu, Taiwan · Santa Clara, CA.* Openings: 1–2.* Taiwan roles are employed through a local employer of record. Mandarin is a strong plus for Taiwan roles; English is required for written work.* Pay: $150,000–$200,000 base (Santa Clara, CA).* Ranges are base pay for U.S. roles and depend on location, experience, and level. Full-time roles also include equity and benefits. Taiwan pay is set to the local market and discussed in the first call.* Start date and employment details are discussed during the process.Apply for this role →Applications are reviewed against the work described here. We do not use a degree, title, or keyword list as a substitute for evidence.