Optical Packaging Engineer — Fiber-to-Chip in Quantum Tech

black.ai; Milpitas (CA); On-site; USD 39,000 - 65,000; Full time

Benefits offered by this job

Health coverage

401(k) with company match

Equity grants

Paid holidays

Job summary

PsiQuantum is seeking an Optical Packaging Associate Engineer to drive hands-on engineering validations, build fiber-coupled optical packages with photonic chips, and collaborate with packaging and operations teams.

The role requires 1–3 years in semiconductor packaging or photonics, with knowledge of optical alignment and metrology. You will contribute to process development, documentation, and production readiness in a fast-paced environment.

Qualifications

• Bachelor’s or Master’s Degree in Engineering, Physics, Materials Science, or related technical field.
• 1–3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing environments.
• Hands-on laboratory or manufacturing experience with precision assemblies and metrology tools.

Responsibilities

• Support hand-on manufacturing of fiber-to-chip packaged chip assemblies.
• Support development, optimization, and validation of optical packaging and active alignment processes.
• Assist in process characterization activities for optical module packaging, including alignment, adhesive curing, and optical performance evaluation.
• Execute experiments and collect data to improve optical coupling efficiency, process stability, and assembly yield.
• Support NPI activities by contributing to process development, documentation, and production readiness.

Skills

Optical alignment

Data analysis

Cross-functional collaboration

Problem solving

Education

Bachelor’s or Master’s Degree in Engineering, Physics, Materials Science, or related technical field

Tools

Excel

MATLAB

Python

JMP

Job description

PsiQuantum is seeking an Optical Packaging Associate Engineer to drive hands-on engineering validations, build fiber-coupled optical packages with photonic chips, and collaborate with packaging and operations teams.

The role requires 1–3 years in semiconductor packaging or photonics, with knowledge of optical alignment and metrology. You will contribute to process development, documentation, and production readiness in a fast-paced environment.