Onsite Senior Mechanical Engineer – FEA and Chassis Design

Hewlett Packard Enterprise Company; Sunnyvale (CA); On-site; USD 124,000 - 251,000; Full time

Job summary

Hewlett Packard Enterprise Company is seeking a Senior Mechanical Engineer to lead the mechanical design, structural analysis, and qualification of complex networking systems from concept through production. The role focuses on FEA, prototype evaluation, and lab testing, requiring hands‑on engineering and strong collaboration with cross‑functional teams.

The ideal candidate will deeply understand chassis development, system packaging, and high‑density electronics, with extensive experience in

Qualifications

• 7+ years of experience in electromechanical product development.
• Extensive experience with chassis development, system packaging, and high‑density electronic assemblies.
• BS in Mechanical Engineering, Applied Physics or equivalent.
• Experience developing networking, server, storage, telecommunications, or HPC systems.
• Experience with FEA and familiarity with ANSYS Workbench, including static‑structural, modal analysis, transient mode superposition, eigenvalue buckling, and thermal analyses.

Responsibilities

• Lead mechanical design, structural analysis, development and qualification of complex networking systems from concept to production.
• Conduct FEA studies, prototype evaluation, lab testing, and root‑cause investigations.
• Collaborate with cross‑functional teams and suppliers to resolve design/manufacturing issues.

Skills

Experience in electromechanical design

Mechanical engineering fundamentals

Education

BS in Mechanical Engineering or equivalent

Tools

ANSYS Workbench

SolidWorks

EPDM PLM

ECAD‑MCAD integration

Job description

Hewlett Packard Enterprise Company is seeking a Senior Mechanical Engineer to lead the mechanical design, structural analysis, and qualification of complex networking systems from concept through production. The role focuses on FEA, prototype evaluation, and lab testing, requiring hands‑on engineering and strong collaboration with cross‑functional teams.

The ideal candidate will deeply understand chassis development, system packaging, and high‑density electronics, with extensive experience in