Ocotillo Technology Fabrication Senior Device Engineer

Intel GmbH

Phoenix (AZ)

On-site

USD 136,990 - 193,390

Full time

14 days+

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Benefits offered by this job

Competitive Pay
Stock Options
Bonuses
Health Benefits
Retirement Plans
Vacation Days

Job summary

Join a forward-thinking company as a Senior Device Engineer, where you'll be at the forefront of semiconductor innovation. This role offers the chance to work on cutting-edge CMOS technology, collaborating with diverse teams to enhance device performance and efficiency. You will play a pivotal role in developing advanced device architectures tailored to customer needs, ensuring compatibility with existing manufacturing processes. With a focus on continuous learning and mentorship, this position promises a dynamic and rewarding environment where your expertise will directly impact the future of semiconductor manufacturing. If you're passionate about technology and eager to make a difference, this opportunity is for you.

Qualifications

  • 5+ years in CMOS device engineering with strong knowledge in device physics.
  • Experience in advanced CMOS technology and foundry NPI activities.

Responsibilities

  • Collaborate with teams to develop fabrication processes and device technologies.
  • Drive development of customized semiconductor device technologies.

Skills

CMOS Device Knowledge
Data Analysis
Technical Problem-Solving
Project Management
Communication Skills

Education

Bachelor's Degree in Electrical Engineering
Master's Degree in Electrical Engineering

Tools

Data Analytic Techniques
Engineering Data Analysis Tools

Job description

Job Description

Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundry's Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using some of the world's most advanced manufacturing processes. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy with Foundry Capability, Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond. This exciting transformation at Intel needs talented candidates with Device engineering experience in Foundry to service local and global customers.

This job requisition is to seek an experienced Device engineer to join OTF to build a strong Yield engineering team including Integration and Device for Intel 18A technology to service global foundry customers. Candidates must possess strong CMOS Device knowledge with experiences in the generation and analysis of device parametric data, design of experiment (DOE) principles, and engineering data analysis tools. The role is focused on CMOS device technology with embedded features to support a range of applications and will work closely with a team of engineers to push the boundaries of device performance, power efficiency, and scaling.

As a Senior Device Engineer, you may be responsible for but not limited to:

  • Collaborate with the manufacturing team to develop and refine fabrication processes that meet device specifications and yield targets.
  • Collaborate with the Development team to develop new device technology and customize newly developed device architectures to customer needs.
  • Develop CMOS logic device technologies with embedded features for various foundry customer use in a large-volume manufacturing environment.
  • Drive the development and implementation of customized semiconductor device technologies, ensuring compatibility with Intel's existing manufacturing processes and platforms.
  • Demonstrated expertise in CMOS semiconductor device physics and fabrication of advanced transistor device architectures.
  • Owning NPI (New Product Introduction) in production fabs and perform product-specific device characteristics optimizations and DOE.
  • Proficiency in data analysis, scripting, and data analytic techniques to accelerate learning.
  • Strong technical problem-solving skills and excellent communication skills, with the ability to convey complex technical concepts effectively.
  • Ability to work collaboratively in a globally diverse, cross-disciplinary team to develop innovative device solutions on an aggressive schedule.
  • Project management by managing timelines and deliverables for multiple projects, providing regular updates and progress reports.
  • Provide technical guidance and mentorship to junior device engineers, fostering a strong culture of continuous learning and development.
  • Desire to learn, lead, and influence cross-functional teams.
Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelor's Degree in Electrical Engineering, Physics, or related field of study with 5+ years or a Master's degree with 3+ years of experience in CMOS device engineering, device physics, logic, architecture, and interconnect development on leading-edge technology nodes.
  • Experience in advanced CMOS device technology, preferably in a foundry environment.
  • Experience of foundry NPI activities and trouble-shooting tape-out issues with exceptional communication skills to communicate complex concepts, solutions, and strategic initiatives.
  • Experience with IC wafer fabrication process engineering, manufacturing systems, semiconductor materials, and wafer test (e.g., fabrication areas may include photolithography and advanced patterning, thin film deposition, planarization, defect metrology, or spectroscopy).
  • Experience interpreting product data including inline, e-test, and SORT data, finding failure root cause and inline indicators, and driving for solutions.

Preferred Qualifications:

  • Post graduate degree in Electrical Engineering, Physics, or related field of study with 5+ years of experience in CMOS device engineering.
  • Hands-on experience in advanced node semiconductor technology device development.
  • Experience working on in 3nm-16nm FinFETs and sub 3nm GAA FETs.
  • Experience in a High-Volume Manufacturing environment.
  • Experience with Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, test structure design, device modeling, and electrical characterization.
  • Demonstrated experience managing the balance between foundry and customer needs. Direct experience working with external customers. Familiarity with industry standards and certifications.
Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Annual Salary Range for jobs which could be performed in the US $136,990.00-$193,390.00
*Salary range dependent on a number of factors including location and experience.

Working Model

This role will require an on-site presence.
* Job posting details (such as work model, location or time type) are subject to change.

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