NPI Process Integration Engineer

Micron Technology, Inc; Boise (ID); On-site; USD 90,000 - 150,000; Full time

Benefits offered by this job

Medical/Dental/Vision

Paid time off & holidays

Relocation support

Job summary

Micron Technology, Inc. seeks a Process Integration Program Engineer in Boise, ID.

You will manage system setup, traveler creation, and pilot scheduling for new product introductions; coordinate startup planning with risk assessments and resource alignment; support yield curve projections and performance tracking for business planning. You will also oversee sampling plans, attribute management, SWR processing, and hold management, collaborating with planning, operations and engineering on wafer,

Qualifications

• Experience in semiconductor manufacturing, PTO, NPI, or related engineering disciplines.
• Knowledge of DRAM and/or NAND technologies.
• Strong analytical and problem-solving skills.
• Excellent communication and cross-functional collaboration abilities.

Responsibilities

• Manage system setup, traveler creation, and pilot scheduling for new product introductions.
• Coordinate startup planning activities, including risk assessments and resource alignment.
• Support yield curve projections and performance tracking for business planning and forecasting.
• Oversee sampling plans, attribute management, SWR processing, and hold management activities.
• Partner with planning, operations, and engineering teams to manage wafer, reticle, and priority lot requirements.

Skills

Semiconductor

NPI knowledge

Analytical skills

Cross-functional teamwork

Communication

AI analytics

Education

Engineering degree

Job description

Micron Technology, Inc. seeks a Process Integration Program Engineer in Boise, ID.

You will manage system setup, traveler creation, and pilot scheduling for new product introductions; coordinate startup planning with risk assessments and resource alignment; support yield curve projections and performance tracking for business planning. You will also oversee sampling plans, attribute management, SWR processing, and hold management, collaborating with planning, operations and engineering on wafer,