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Ascentec Engineering is seeking an experienced NPI Machinist to develop machining processes for low to mid-volume production parts. This on-site role at our Tualatin headquarters requires working with CNC programming and planning to establish repeatable production methods.
The ideal candidate has seven years of precision horizontal and 5-axis CNC machining experience, GD&T expertise, and familiarity with multiple controller families (Haas, Fanuc, Mazak, Okuma, Siemens).
Ascentec Engineering is hiring a New Product Introduction (NPI) Machinist. The selected candidate will develop the machining processes for low to mid-volume production parts.
This position is on-site (not remote/not hybrid) at our Tualatin headquarters. This role is not eligible for Visa sponsorship or transfer of Visa sponsorship.
Applicant must be able to pass a drug screen and criminal background check prior to employment.
To conform to U.S. Government space technology export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
Ascentec Engineering is an Equal Opportunity Employer; employment with Ascentec Engineering is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
At Ascentec Engineering, we turn complex designs into high-precision reality. Headquartered in Tualatin, Oregon—with facilities across Oregon and global hubs in Malaysia, Vietnam, and India—we specialize in advanced 5-axis CNC machining, electronic manufacturing tooling, Friction Stir Welding, and precision assembly for industry leaders in aerospace, semiconductor, spaceflight, and thermal management.