New Grad Design Engineer — Memory & Semiconductors

Micron Memory Malaysia Sdn Bhd

Boise (ID)

Hybrid

USD 70,000 - 100,000

Full time

11 days ago

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Job summary

Micron Technology in Boise, Idaho is seeking a New College Grad Design Engineer for DRAM technology and products. The role focuses on design, analysis, and optimization of digital and analog circuits in memory devices.

You will work with cross-functional teams across design, verification, product engineering, and validation to deliver high-quality memory solutions with attention to power, performance, area, and manufacturability.

Qualifications

  • Bachelor of Science in Electrical Engineering or higher.
  • Basic understanding of memory array architectures and memory circuits.
  • Experience with circuit simulation, setup, debugging, and analysis using standard tools.

Responsibilities

  • Design, layout, simulate, and optimize memory circuits and devices to meet performance, power, area, and reliability needs.
  • Develop and support schematic blocks including memory arrays, control logic, address decoding, datapath circuitry, and internal test logic using SPICE and Verilog.
  • Perform circuit verification, parasitic extraction, design-for-manufacturability, and debugging to improve functionality and yield.
  • Collaborate with multi-functional teams to define test chip strategies and support silicon validation.
  • Apply AI-enabled tools to improve design efficiency and analysis workflows.

Skills

Memory architectures
Circuit design
Debugging
Technical communication

Education

BSEE or higher in Electrical Engineering

Tools

SPICE
Verilog

Job description

Micron Technology in Boise, Idaho is seeking a New College Grad Design Engineer for DRAM technology and products. The role focuses on design, analysis, and optimization of digital and analog circuits in memory devices.

You will work with cross-functional teams across design, verification, product engineering, and validation to deliver high-quality memory solutions with attention to power, performance, area, and manufacturability.

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