MEMS Process & Packaging Engineer — Build Next‑Gen Sensors

Seek Thermal; Goleta (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Seek Thermal is seeking a MEMS Semiconductor and Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through packaging. You will work with suppliers across front-end MEMS processes and back-end assembly, aiming to sustain yield, improve processes, and qualify new tools for production.

You will design DOEs, perform metrology-driven analysis, and collaborate with design, test, reliability, and QA teams on new products.

Qualifications

• BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred.
• 5+ years of hands-on process engineering in MEMS or semiconductor wafer fab, with at least 2 years covering assembly/packaging.

Responsibilities

• Own and sustain MEMS fabrication processes to yield, Cpk, and cost targets.
• Develop and qualify assembly and packaging processes: wafer-to-wafer bonding, getter activation and vacuum sealing, dicing, die attach, and wire bonding.
• Characterize bond interfaces and package hermeticity using SAM, IR microscopy, SEM/FIB cross-sections, and long-term vacuum-integrity monitoring.
• Design and run DOEs; use SPC and statistical analysis (JMP, Python) to identify drivers of yield loss and drive corrective and preventive actions.
• Manage outsourced process steps at external suppliers: define specifications, review vendor data, run qualification lots, and disposition non-conforming material.
• Perform root-cause failure analysis; drive containment and permanent fixes through the MRB/CCB process.
• Partner with device design, test, reliability, quality, and engineering functions on new-product introduction and design-for-manufacturability reviews.

Skills

MEMS process engineering

Semiconductor wafer fabrication

Assembly/Packaging

DOE

SPC

FMEA

Cleanroom operations

Python

LabVIEW

JMP

Education

BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field

MS preferred

Tools

Python

LabVIEW

JMP

Job description

Seek Thermal is seeking a MEMS Semiconductor and Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through packaging. You will work with suppliers across front-end MEMS processes and back-end assembly, aiming to sustain yield, improve processes, and qualify new tools for production.

You will design DOEs, perform metrology-driven analysis, and collaborate with design, test, reliability, and QA teams on new products.