MEMS Process Engineer — Wafer Bonding & Packaging

Seek Thermal, Inc; Goleta (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Seek Thermal, Inc. is seeking a MEMS Semiconductor and Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through wafer-level packaging and testing.

The role spans front-end processes and back-end assembly, coordinating with external suppliers to sustain yield and qualify new processes for production. The candidate will design DOEs, apply SPC/FMEA in a production setting, and communicate findings across design, test, reliability, and quality teams.

Qualifications

• BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred.
• 5+ years of hands-on process engineering in MEMS or semiconductor wafer fab; 2+ years in assembly/packaging.
• Experience with thin-film deposition, lithography, etch, and packaging interactions.
• Ability to read metrology and failure-analysis data and act on it.
• Clear written and verbal communication with suppliers, vendors, and cross-functional teams.

Responsibilities

• Own and sustain MEMS fabrication processes to yield, Cpk, and cost targets.
• Develop and qualify assembly and packaging processes: wafer-to-wafer bonding, vacuum sealing, die attach, and wire bonding.
• Characterize bond interfaces and hermeticity using SAM, IR microscopy, SEM/FIB, and vacuum monitoring.
• Design and run DOEs; use SPC and statistical analysis to identify yield drivers and drive actions.
• Manage outsourced process steps at external suppliers; define specs and review data.
• Perform root-cause failure analysis; drive fixes through MRB/CCB.
• Collaborate with design, test, reliability, quality, and manufacturing for NPI and DFM.

Skills

DOE

SPC

FMEA

Cleanroom

Metrology interpretation

Supplier communication

Python scripting

Education

Bachelor's degree in Electrical/Mechanical Engineering or related field

Tools

Python

LabVIEW

JMP

Job description

Seek Thermal, Inc. is seeking a MEMS Semiconductor and Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through wafer-level packaging and testing.

The role spans front-end processes and back-end assembly, coordinating with external suppliers to sustain yield and qualify new processes for production. The candidate will design DOEs, apply SPC/FMEA in a production setting, and communicate findings across design, test, reliability, and quality teams.