MEMS Process Engineer II — On-Site, Plymouth MN

Honeywell Aerospace US LLC in; Plymouth (MN); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Medical, dental, vision insurance

401(k) match

Paid holidays

Job summary

Honeywell Aerospace is seeking a Semiconductor Manufacturing Engineer II to advance MEMS and silicon manufacturing processes at Plymouth, MN, on-site. You will optimize dry etch steps, troubleshoot complex issues, and work with design, quality, and production teams to meet technology goals.

You will report to the Wafer Fab Engineering Manager and contribute to new capital equipment qualifications, process improvements, and manufacturing efficiency enhancements.

Qualifications

• Bachelor's degree in a technical discipline such as science, technology, engineering or mathematics.
• 2 years of experience in semiconductor or MEMS manufacturing engineering or related process engineering roles.
• Knowledge of SPC and DOE setup and analysis.
• USG security clearance in good standing, or U.S. citizenship with no barriers to obtaining clearance.

Responsibilities

• Develop and optimize MEMS dry etch manufacturing processes to improve yield, quality, and throughput.
• Troubleshoot dry etch processes and understand variability to optimize process control.
• Troubleshoot and resolve complex manufacturing issues using engineering principles and data analysis.
• Collaborate with senior engineers, design, quality, and production teams to implement process improvements.

Skills

2 years MEMS/semiconductor engineering

SPC knowledge

DOE setup & analysis

Process optimization

Education

Bachelor's degree in STEM

Job description

Honeywell Aerospace is seeking a Semiconductor Manufacturing Engineer II to advance MEMS and silicon manufacturing processes at Plymouth, MN, on-site. You will optimize dry etch steps, troubleshoot complex issues, and work with design, quality, and production teams to meet technology goals.

You will report to the Wafer Fab Engineering Manager and contribute to new capital equipment qualifications, process improvements, and manufacturing efficiency enhancements.