MEMS Engineering Manager 1

HP; Corvallis (MT); On-site; USD 131,000 - 205,000; Full time

Benefits offered by this job

Health insurance

Dental insurance

Vision insurance

Long term/short term disability保险

Job summary

HP, Inc. is seeking an Engineering Manager to lead a MEMS process/product development team focused on innovating, characterizing, and stabilizing fabrication processes for inkjet components and other microfluidic devices.

The role requires setting strategy, defining objectives, delivering project schedules, hiring and developing staff, and guiding the team to meet technology roadmaps and product requirements.

Job description

Responsibilities

This manager will be responsible for a MEMS process/product development engineering team that innovates, characterizes, and stabilizes fabrication processes used to produce inkjet components and other microfluidic devices. Our fab uses a variety of processes including traditional photo, deposition, etch, and bond technologies as well as less common micromachining and packaging methods. The Manager in this role will be responsible for setting strategy for the team, defining team objectives, establishing and delivering to project schedules, hiring, and developing the engineering staff. With the engineering team, the manager will deliver to the following key objectives:

Major Responsibilities

This manager will be responsible for a MEMS process/product development engineering team that innovates, characterizes, and stabilizes fabrication processes used to produce inkjet components and other microfluidic devices. Our fab uses a variety of processes including traditional photo, deposition, etch, and bond technologies as well as less common micromachining and packaging methods. The Manager in this role will be responsible for setting strategy for the team, defining team objectives, establishing and delivering to project schedules, hiring, and developing the engineering staff. With the engineering team, the manager will deliver to the following key objectives:

• Lead the development of new MEMS processes and tooling capabilities to support next generation product development
• Ensure on time delivery of MEMs processes with acceptable R&R’s, controls and safety to meet/exceed the performance targets as defined by the various technology roadmaps and product requirements
• Collaborate with product development teams and other key partners to ensure development deliverable are on track and prioritized.
• Drive improvements to meet or exceed POR commitments (capacity, process cycle time, yield and cost)
• Establish and maintain a process technology roadmap for the team.
• Incorporate Lean Development Methodologies (LPPD, lean problem solving, etc)
• Ensure successful completion of process and technology transfers. Manage process convergence with High Volume Manufacturing sites.
• Support efficient Fab operation through excellent relationships with Operations
• Provide direction for the Workcenters as the Engineering Management Sponsor
• Manage the Equipment Strategy for these areas to meet the technology and capacity needs (manage vendors, equipment obsolescence, equipment capability and capacity)

Perform all necessary HP management duties including:

• Establish prioritized team objectives and communicate how they link to key organizational objectives, product portfolio, and technology roadmaps
• Work with product development teams to translate new product specifications into manufacturable designs
• Develop and manage resource plans
• Set and deliver to department budgets, participate in the Lab’s budget planning process
• Define program schedules, define priorities, make appropriate project trade-offs
• Deliver employee performance evaluations, performance management processes, work to develop employees, provide ongoing feedback to engineers

The pay range for this role is $130,700 to $205,200 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job

Engineering

Schedule

Full time

Shift

No shift premium (United States of America)

Travel

Not Specified

Relocation

No

Equal Opportunity Employer (EEO)

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal"