Mechanical Engineer

0090 CORP-Corporate Office; United States; On-site; USD 77,600 - 116,400; Full time

Benefits offered by this job

Health insurance

Life and disability insurance

Paid time off

Job summary

Northrop Grumman is seeking a Mechanical Engineer in Rolling Meadows, Illinois to support the development and validation of ruggedized electronic equipment. This role involves hardware design, analysis, and leading multidisciplinary teams.

Qualifications include a Bachelor or Master's in Mechanical or Aerospace Engineering and experience with hardware development. The position offers an annual salary range of $77,600 to $116,400, dependent on qualifications.

Qualifications

• Minimum of two years of experience in electronics packaging.
• Extensive experience with hardware development and electro-mechanical packaging.
• Strong written, verbal, and interpersonal communication skills.

Responsibilities

• Work on the entire product life cycle from analysis to testing.
• Serve on multidisciplinary engineering teams.
• Document design work through drawing generation and release.

Skills

Hardware design

Electro-mechanical systems

3-D CAD tools

Leadership

Communication

Education

Bachelor of Science in Mechanical or Aerospace Engineering

Master of Science in Mechanical or Aerospace Engineering

Tools

Siemens NX

ANSYS

Job description

Relocation assistance may be available. Clearance type: SAP. Travel requirements: 10% of the time.

Position Overview

Northrop Grumman is seeking a Mechanical Engineer in the Mission Systems Sector located in Rolling Meadows, Illinois. The role supports the development, build, and test validation of ruggedized electronic equipment for military applications within the Hardware Engineering organization.

Responsibilities

• Apply and expand experience in hardware design, analysis, documentation, and integration of electro‑mechanical systems.
• Work on the entire product life cycle, including requirements analysis, concept definition, detailed design, production, and environmental test.
• Serve on multidisciplinary engineering teams, interfacing heavily with other mechanical engineers, analysts, and related disciplines, program management, and customers/stakeholders.
• Solve challenging technical problems with innovative solutions that meet performance, cost, and schedule objectives.
• Present design solutions and analysis during internal and external design reviews.
• Document design work through drawing generation, release, and provide factory and supplier support.
• Support change incorporations and contribute to continuous improvement of the organization.
• Coach junior staff, transfer knowledge, and participate in process improvement activities.
• Communicate effectively in written and verbal form at all stages of the role.

Qualifications

• Bachelor of Science in Mechanical or Aerospace Engineering with a minimum of two years of experience in electronics packaging OR a Master’s degree in Mechanical or Aerospace Engineering.
• Extensive experience with hardware development and electro‑mechanical packaging, including at least one of the following: thermal analysis, structural analysis, microelectronics design, opto‑mechanical design, or environmental testing.
• Proficiency with 3‑D CAD tools (Siemens NX preferred) and product data management tools.
• Demonstrated leadership of small to moderately sized teams during the product development process, including review of technical work products.
• Demonstrated application of innovative solutions to complex problems in design, development, and production phases.
• Strong written, verbal, and interpersonal communication skills, including experience presenting at design reviews and customer or stakeholder briefings.
• Ability to determine appropriate technical approaches and exercise latitude in assignment decisions.
• U.S. citizen required.
• Ability to obtain and maintain a minimum Secret clearance and any additional customer‑specified clearance prior to start.

• Master of Science degree in Mechanical or Aerospace Engineering (preferred).
• Expertise with ANSYS or other design analysis tools.
• Familiarity with opto‑mechanical engineering.
• Knowledge of military and commercial process specifications.
• Proficiency in geometric dimensioning and tolerancing.
• Success leading others within an integrated product team and supporting junior engineers.
• Experience with project management metrics, including earned value management.
• Experience in design, manufacturing, and integration of electronic assemblies using appropriate material selections and off‑the‑shelf components.
• Experience contributing to technical and cost proposal development.
• Leadership in process improvement or knowledge transfer activities (e.g., publication).

Compensation

Primary Level Salary Range: $77,600.00 – $116,400.00. Salary is influenced by scope, responsibilities, experience, education, skills, and current market conditions.

Benefits

Northrop Grumman offers health insurance coverage, life and disability insurance, a savings plan, company‑paid holidays, and paid time off for vacation and personal business.

Security Clearance

The position requires U.S. Government clearance. A minimum Secret clearance is required, with additional customer‑specified clearance to be obtained before employment begins.

EEO Statement

Northrop Grumman is an Equal Opportunity Employer and does not discriminate on the basis of race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.