Manufacturing Engineer Intern: Optimize Assembly Throughput

Bosch

Lincolnshire (IL)

On-site

USD 28,000 - 37,000

Full time

14 days+

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Job summary

Bosch Rexroth in Lincolnshire, IL, offers a 2027 Summer Internship program designed to develop future engineering resources. Interns will engage in tool design, testing, and layout improvements, with tasks increasing in complexity as proficiency grows.

This paid internship aims to prepare interns for entry-level roles after graduation. Applicants should be undergrad engineering students with a 3.0+ GPA, Proficient in Creo and MS Office, and possess strong communication, self-motivation, and

Qualifications

  • Committed to an engineering college undergraduate program.
  • Minimum 3.0 GPA required.
  • Basic CAD modeling proficiency, preferably Creo.
  • Basic MS Office proficiency.
  • Strong written and oral communication and interpersonal skills.
  • Self-directed and motivated.
  • Majors desired: Manufacturing, Mechanical, Electrical, Industrial or Mechanical Engineering Technology.

Responsibilities

  • Tool design using Creo with dimensioning drawings.
  • Conduct testing experiments following a measurement plan and FMEA.
  • Improve layouts of assembly cell to optimize flow.
  • Develop improvements to boost throughput and eliminate waste.
  • Implement 5S methodology in shop floor.
  • Provide production assembly and testing support.

Skills

Communication skills
Self-directed
Motivated

Education

Undergraduate engineering student

Tools

PTC Creo
MS Office

Job description

Bosch Rexroth in Lincolnshire, IL, offers a 2027 Summer Internship program designed to develop future engineering resources. Interns will engage in tool design, testing, and layout improvements, with tasks increasing in complexity as proficiency grows.

This paid internship aims to prepare interns for entry-level roles after graduation. Applicants should be undergrad engineering students with a 3.0+ GPA, Proficient in Creo and MS Office, and possess strong communication, self-motivation, and

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