Liquid Cooling Thermal Engineer for AI/ML HPC

Amphenol Communications Solutions

Schaumburg (IL)

On-site

USD 85,000 - 140,000

Full time

7 hours ago
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Job summary

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions and a major provider of data center, telecom, and AI/ML hardware cooling technologies. The Product Development Engineer will lead liquid cooling design for high-density I/O connectors, working on thermal plates, flow paths, and materials for reliability in data center environments.

Based on the Schaumburg, IL site, the role emphasizes cross-functional collaboration, testing,

Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field.
  • 4+ years in product development, preferably in thermal management or connector technologies.
  • Minimum 3 years of experience with Liquid Cooling and CFD.
  • Strong proficiency in CAD tools and thermal simulation software.

Responsibilities

  • Architect and develop liquid cooling plates for high-density front-end I/O connector applications.
  • Engineer microchannel structures, cold plate geometries, and flow path configurations to maximize thermal efficiency and minimize pressure drop.
  • Define and execute thermal performance testing, including heat dissipation, flow rate analysis, and environmental stress testing.
  • Lead cross-functional development projects from concept through production.
  • Serve as a technical liaison with customers to understand requirements and deliver exceptional support.

Skills

Liquid cooling
CFD
Thermal engineering
Customer-facing

Education

Bachelor's or Master's in Mechanical Engineering

Tools

SolidWorks
Creo
ANSYS
FloTHERM

Job description

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions and a major provider of data center, telecom, and AI/ML hardware cooling technologies. The Product Development Engineer will lead liquid cooling design for high-density I/O connectors, working on thermal plates, flow paths, and materials for reliability in data center environments.

Based on the Schaumburg, IL site, the role emphasizes cross-functional collaboration, testing,

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