LFAB Process Technician - Day Shift

118-WW TMG MFG OPS; Lehi (UT); On-site; USD 38,572 - 49,593; Full time

Job summary

118-WW TMG MFG OPS in Lehi, Utah is seeking an LFAB PE Implant Process Technician on the A shift to support implant manufacturing. You will work closely with process engineers and line operators to run tests, troubleshoot equipment, and drive process improvements in a fast-paced fab.

Preferred candidates bring implant process knowledge or beam tuning, strong teamwork, and reliable communication. A high school diploma and the ability to work 12-hour shifts, including weekends, are required.

Qualifications

• High school diploma or GED required.
• 3 years semiconductor Process Tech experience or 8 years non-semiconductor/military technician experience.
• Ability to work 12-hour compressed shift including weekends/holidays.

Responsibilities

• Support process engineers in technical tests and experiments.
• Monitor, audit, and guide line operators.
• Process test runs and prepare results for engineering.
• Investigate chronic issues to improve fab performance.
• Provide technical assistance to process development and engineering.
• Additional tasks include SPC: limit calculation/maintenance and data collection for NPI, FMEA, SRC, and tool release PRD documentation.

Skills

Troubleshooting

Team collaboration

Communication skills

Problem solving

Time management

Education

High School diploma/GED

Job description

About the Job

We're looking for a LFAB PE Implant Process Technician to join the PE Implant team on A shift:

Responsibilities

• Support Mfg Process Engineers in performing technical tests and experiments
• Monitors, audits, and provides guidance to line operators.
• Processes test runs and prepares results for engineering to identify yield problems or test new products.
• Investigate and resolve chronic manufacturing issues to elevate the performance of the module and enable lasting solutions.
• Perform troubleshooting to determine problems in equipment/process.
• Provide technical assistance to process development and engineering personnel.
• Additional activities may include:
  • SPC: limit calculation/maintenance, reaction mechanism upkeep, chart monitoring
  • New Product Support: PRD data collection, tool qual data collection, NPI setup
  • Product Quality: FMEA upkeep, quality event data collection
  • Yield: SRC IDR data collection, multi-lot investigation, SRC setup
  • Cost Reduction: qual management
  • Capacity/Mfg: Priority lot tracking, tool hold release, CCB/PDB/Tool Release PRD Documentation

Minimum Requirements

• High School diploma/GED
• 18 years of age or older
• One of the following:
  • 3 years of semiconductor experience as Process Technician OR
  • 8 years of non-semiconductor/military Technician experience
• Ability to work 12 hour compressed work schedule
• Flexible to work day or night shift that will include one weekend shift and holidays

Preferred Qualifications

• Implant Process knowledge/experience and Beam Tuning
• Excellent organizational, teaming and troubleshooting skills
• Self-driven with ability to identify/resolve issues to improve fab performance
• Demonstrated strong analytical and problem solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced global team environment with other technical teams
• Ability to take the initiative and drive for results