Lead Wide-Bandgap Device & Process Engineer

MIT Lincoln Laboratory

Lexington (MA)

Sur place

USD 145 000 - 220 000

Plein temps

14 jours+

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Un CV et une lettre de motivation personnalisés, prêts à envoyer.

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Avantages offerts par ce poste

Health, dental, and vision plans
MIT-funded pension
Matching 401K
Paid leave (vacation, sick, parental)
Tuition reimbursement and continuing-

Résumé du poste

MIT Lincoln Laboratory in Lexington, MA seeks an engineer/scientist to advance ultra-wide bandgap semiconductor devices from first demonstrations to prototypes for technology transfers. Focus areas include RF electronics, power electronics, and extreme-environment applications.

The role demands strong technical leadership and collaboration across groups, with a path toward IP development and external partnerships.

Qualifications

  • PhD (or equivalent) in Electrical Engineering, Mechanical Engineering, Materials Science and Engineering or related field.
  • Deep understanding of ultra-wide bandgap semiconductors (SiC, GaN, Diamond) and device physics for power/RF.
  • Hands-on packaging, lithography, deposition, etching, integration, and metrology.
  • Experience in semiconductor clean room environments.
  • Experience with design of experiments and data-driven problem solving.
  • Experience with device testing (DC/CV/RF) and programming (MATLAB, Python, LabVIEW).
  • Strong communication and cross-functional teamwork skills.
  • Ability to work independently and with sponsors for technology transfer.

Responsabilités

  • Evaluate materials, composition, doping, and process steps to meet device specs and yield.
  • Collaborate with process engineers to define flows and analyze results.
  • Develop novel device and circuit elements aligned with mission requirements.
  • Plan packaging and electrical testing, thermal and reliability characterization, and data analysis.
  • Investigate device failures using advanced microscopy/spectroscopy and root-cause analysis.
  • Work with cross-functional teams to plan development and integration strategies.
  • Engage with sponsors for technology transfer and communications.
  • Contribute to IP development, publications, and external collaborations.

Connaissances

Ultra-wide bandgap semiconductors
Device physics
Epitaxial growth
Fabrication & process development
Device packaging
Test & characterization
Microscopy & spectroscopy
Design of experiments
MATLAB
Python
Team leadership
Project management
Communication
Sponsor engagement

Formation

PhD in Electrical Engineering or Materials Science & Engineering

Outils

Synopsys
Silvaco
COMSOL
JMP
MATLAB
Python
LabVIEW
SEM/TEM (microscopy)

Description du poste

MIT Lincoln Laboratory in Lexington, MA seeks an engineer/scientist to advance ultra-wide bandgap semiconductor devices from first demonstrations to prototypes for technology transfers. Focus areas include RF electronics, power electronics, and extreme-environment applications.

The role demands strong technical leadership and collaboration across groups, with a path toward IP development and external partnerships.

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