Lead Front-End Process Integration for Uniformity & Yield

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Choice of medical, dental, and vision plans

Income protection programs

Robust paid time-off program

Paid holidays

Job summary

1000 Micron Technology, Inc. is seeking a highly skilled professional for process integration in Boise, Idaho. The role focuses on structural uniformity in semiconductor production with collaboration across teams to enhance performance and yield.

Candidates should have over 7 years in the semiconductor field and a relevant degree. Benefits include comprehensive health plans and generous paid time off.

Qualifications

• 7+ years of experience in a process-related role in the semiconductor industry.
• Strong knowledge of semiconductor fabrication process flows and interactions.
• Understanding of DRAM and NAND operation.

Responsibilities

• Lead process integration structural uniformity and cross-loop integration.
• Drive node-over-node integration and achieve quality targets.
• Collaborate with process owners to optimize integration structures.

Skills

Model-based problem solving

Data-driven decision making

Strong presentation skills

Excellent verbal and written communication

Interpersonal skills

Education

Bachelor’s, Master’s, or Ph.D. in Electrical Engineering

Materials Engineering

Materials Science

Physics

Chemical Engineering

Job description

1000 Micron Technology, Inc. is seeking a highly skilled professional for process integration in Boise, Idaho. The role focuses on structural uniformity in semiconductor production with collaboration across teams to enhance performance and yield.

Candidates should have over 7 years in the semiconductor field and a relevant degree. Benefits include comprehensive health plans and generous paid time off.