Lead Engineer

Langham Recruitment; San Francisco (CA); On-site; USD 200,000 - 275,000; Full time

Job summary

Langham Recruitment is seeking an Engineering Lead in San Francisco for a top optical communications firm. You'll lead the development of advanced high-speed modulators designed for next-gen data centers and AI products.

Expect responsibilities that range from device design through to production, with a focus on III-V materials. The role requires an MSc or PhD in a related field and strong leadership in relevant technologies.

The position offers a competitive salary range of $200,000 to $275,000, along with bonus and stock options.

Qualifications

• MSc or PhD in Electrical Engineering, Physics, Semiconductor Devices, or related field.
• Deep expertise in III-V materials, epitaxy, device physics, and fabrication.
• Proven leadership in DFB lasers or electro-absorption modulators.

Responsibilities

• Drive end-to-end development from epitaxy and modulator design.
• Design and simulate photonic integrated circuits (PICs).
• Lead testing, data analysis, and performance improvement.

Skills

Expertise in III-V materials

Device testing and characterisation

Simulation and modelling skills

Leadership in DFB lasers or EML/EAM

Education

MSc or PhD in Electrical Engineering, Physics, or related

Job description

Engineering Lead – High Speed modulators - Bay Area

$200,000 – $275,000 + Bonus + Stock Options

A leading optical communications company is hiring for an Engineer with a background in designing high-speed optical or Photonic modulators to create advanced III-V modulators for next-generation data centre and AI products.

The Role:

You will drive end-to-end development from epitaxy and modulator device design through fabrication, production, working closely with external foundries and cross-functional teams.

Key Responsibilities:

• Design III-V epitaxial structures (MQWs, waveguides)
• Develop high-speed modulators for high-speed applications (EAM/MZM)
• Design and simulate photonic integrated circuits (PICs)
• Optimise fabrication processes with foundry partners
• Lead testing, data analysis, and performance improvement
• Collaborate with packaging and system teams

Requirements:

• MSc or PhD in Electrical Engineering, Physics, Semiconductor Devices, or related field
• Deep expertise in III-V materials, epitaxy, device physics, and fabrication
• Proven leadership in at least one of the following: 100 mW DFB lasers (O-band or C-band), 100 Gb/s electro-absorption modulators (EML/EAM/MZM)
• Strong simulation and modelling skills (optical + RF + device physics)
• Hands‑on experience with device testing and characterisation
• Experience working with external foundries and driving process optimisation

Compensation:

• $200,000 – $275,000 base salary – Flexibility for exceptional candidates