Lead Architect, Next-Gen Compute & Systems

Arm; Austin (TX); Hybrid; USD 323,000 - 437,000; Full time

Benefits offered by this job

Hybrid work model

Accommodations during recruitment

Job summary

Arm seeks a Lead Architect to drive next‑generation system architectures for data center and networking, blending strategic vision with deep technical insight. You will shape the infrastructure roadmap and guide innovation across compute, memory, and interconnect domains.

You will collaborate with internal and external partners on 3D stacking, chiplets, memory tech, and heterogeneous integration, translating long‑term goals into concrete architectural features for products.

Qualifications

• Minimum 10+ years in SoC/system architecture or advanced technology research.
• Deep knowledge of server-class power management and high-speed IO interfaces like PCIe/SATA, security, and remote system monitoring.
• Strong written, verbal and presentation communication skills.

Responsibilities

• Define next-generation system architectures by industry trends and customer use cases.
• Establish top-down technology objectives guiding research into compute, memory, and interconnect technologies.
• Lead collaboration with internal and external partners to explore 3D stacking, chiplets, memory technologies, packaging, and heterogeneous integration.
• Translate long-term vision into technology strategy and architectural features aligned with product goals.
• Ensure cross-domain alignment of software, silicon, and system for scalable, high-performance infrastructure.
• Present architectural vision to senior teams with data-backed strategy.
• Maintain technology scouting with academia, research consortia, and industry forums.

Skills

SoC/system architecture

Infrastructure architecture knowledge

Communication skills

Education

Bachelor’s or Master’s in Computer Engineering

Job description

Arm seeks a Lead Architect to drive next‑generation system architectures for data center and networking, blending strategic vision with deep technical insight. You will shape the infrastructure roadmap and guide innovation across compute, memory, and interconnect domains.

You will collaborate with internal and external partners on 3D stacking, chiplets, memory tech, and heterogeneous integration, translating long‑term goals into concrete architectural features for products.