Mechanical Engineer

Photonect Interconnect Solutions; City of Rochester (NY); Sur place; USD 20 664 - 34 440; Plein temps

Résumé du poste

Photonect Interconnect Solutions in Rochester, NY is seeking a Mechanical Engineering Intern to assist in developing next-generation optical fiber to photonic integrated circuit technology. The role involves designing components, creating 3D models, collaborating with engineers, and improving interconnect systems.

Candidates should be pursuing a degree in Mechanical Engineering, have CAD experience (preferably SolidWorks), and comply with U.S. export control laws. Apply now for a Summer 2025 internship!

Qualifications

• Strong academic record with relevant coursework in mechanical design principles.
• Basic understanding of laser systems and optical components.
• Excellent problem-solving and analytical skills.
• Strong written and verbal communication abilities.
• Ability to work both independently and in a team environment.

Responsabilités

• Assist in designing and developing mechanical components for interconnect systems.
• Create 3D models and technical drawings using CAD software.
• Support the fabrication and testing of mechanical prototypes.
• Conduct research and perform engineering analyses to improve technology.
• Collaborate with cross-functional teams.
• Document engineering processes and prepare technical reports.

Connaissances

Familiarity with precision alignment techniques and equipment

Knowledge of clean room protocols and practices

Experience with finite element analysis software (e.g., ANSYS)

Interest in photonics and semiconductor technologies

Formation

Currently pursuing a bachelor's degree in Mechanical Engineering or a related field

Outils

CAD software (preferably SolidWorks)

Description du poste

Overview

Photonect is seeking a talented Mechanical Engineering Intern to join our innovative team developing next-generation optical fiber to photonic integrated circuit (PIC) connection technology using our revolutionary laser adhesion process.

Role Description

• Assist in designing and developing mechanical components for our laser-based fiber-to-chip interconnect systems
• Create 3D models and technical drawings using CAD software (preferably SolidWorks)
• Support the fabrication and testing of mechanical prototypes
• Conduct research and perform engineering analyses to improve our interconnect technology
• Collaborate with cross-functional teams, including optical and electrical engineers
• Document engineering processes and prepare technical reports

Due to the nature of our work and its association with U.S. government-funded research, applicants must comply with U.S. export control laws and regulations. This includes eligibility under the International Traffic in Arms Regulations (ITAR) and the Export Administration Regulations (EAR). Candidates must be U.S. citizens, lawful permanent residents, individuals granted asylum or refugee status, or otherwise authorized to access controlled technology as defined by U.S. law.

Requirements

• Familiarity with precision alignment techniques and equipment
• Knowledge of clean room protocols and practices
• Experience with finite element analysis software (e.g., ANSYS)
• Interest in photonics and semiconductor technologies

Qualifications

• Currently pursuing a bachelor's degree in Mechanical Engineering or a related field
• Strong academic record with relevant coursework in mechanical design principles
• Proficiency in CAD software, preferably SolidWorks
• Basic understanding of laser systems and optical components
• Excellent problem-solving and analytical skills
• Strong written and verbal communication abilities
• Ability to work both independently and in a team environment

Join our team and be part of the next generation of high-performance, energy-efficient optical communication systems. Apply now to start your internship in Summer 2025. Send an email to [e-mail].