Integrated Photonics Engineer: Space-Grade PICs & Tape-outs

PLP Group; Phoenix (AZ); Hybrid; USD 125,000 - 185,000; Full time

Job summary

Azora is seeking an on-site/hybrid engineer to advance photonic integrated circuits for high-sensitivity optical transceivers. You will design, simulate, and test PIC components across Si, SiN, and InP platforms, guiding tape-outs through packaging and system integration.

Responsibilities include validating waveguides, modulators, detectors, and filters; coordinating with packaging partners for space-grade hermetic solutions; and collaborating with DSP and FPGA teams to meet radiation and

Qualifications

• MS/PhD in Photonics, Electrical Engineering, or related field.
• 3+ years hands-on PIC design and characterization.
• Experience with photonic simulation and layout tools.
• Experience with at least one commercial foundry PDK and tape-out.
• Strong lab skills: fiber alignment, RF probing, optical test instrumentation.

Responsibilities

• Design and simulate integrated photonic components and circuits.
• Own foundry tape-outs on silicon photonics, SiN, or InP platforms, including DRC, layout, and PDK workflows.
• Develop test plans and carry out wafer- and chip-level characterization.
• Work with packaging partners on fiber attach, hermetic packaging, and co-packaging for space environments.
• Integrate PICs into coherent and photon-counting receiver chains and validate end-to-end sensitivity.
• Assess radiation tolerance and thermal behavior of photonic devices for flight applications.
• Collaborate with mixed-signal and FPGA engineers on driver/TIA interfaces and DSP requirements.

Skills

PIC design

Photonic simulation

Foundry tape-out

Test & measurement

Fiber alignment

RF probing

DSP requirements

Education

MS/PhD in Photonics/Electrical Engineering/Applied Physics

Tools

Lumerical

Synopsys

KLayout

IPKISS

Job description

Azora is seeking an on-site/hybrid engineer to advance photonic integrated circuits for high-sensitivity optical transceivers. You will design, simulate, and test PIC components across Si, SiN, and InP platforms, guiding tape-outs through packaging and system integration.

Responsibilities include validating waveguides, modulators, detectors, and filters; coordinating with packaging partners for space-grade hermetic solutions; and collaborating with DSP and FPGA teams to meet radiation and