Industrial Engineering Intern: Methods & Process

Boeing; Seattle (WA); On-site; USD 40,000 - 80,000; Full time

Job summary

Boeing invites motivated students to join its 2027 intern program in Washington state. Over 10-12 weeks, you’ll work on real projects with a mentor, tour facilities, meet leaders, and build a professional network while gaining aerospace industry experience.

The internship emphasizes teamwork, safety, and practical skills, with pathways to leadership roles and future opportunities at Boeing. Relocation may be available.

Qualifications

• Full-time summer internship for 10-12 weeks during Summer 2027.
• Currently enrolled college/university student with an expected graduation date on or after August 2027.
• Strong academic performance (GPA of 3.0 or above).
• Majoring in Business Administration, Supply Chain Management, Data Analytics, Operations, Project Management, Industrial Engineering, Statistics, Computer Science, Programming, or IT.

Responsibilities

• Work directly with a mentor in your field while solving real-world problems.
• Tour our state-of-the-art manufacturing and R&D facilities to experience our products up close.
• Interact with company leaders to discuss strategy and Boeing's future.
• Build a lasting professional network through intern events and activities.
• Gain skills to help you become a future leader in the aerospace industry.

Skills

Project Management

Data Analysis

Supply Chain Management

Information Technology

SQL/Programming

Education

Currently enrolled student with expected graduation after Aug 2027

GPA 3.0+

Tools

SQL

Job description

Boeing invites motivated students to join its 2027 intern program in Washington state. Over 10-12 weeks, you’ll work on real projects with a mentor, tour facilities, meet leaders, and build a professional network while gaining aerospace industry experience.

The internship emphasizes teamwork, safety, and practical skills, with pathways to leadership roles and future opportunities at Boeing. Relocation may be available.