Heterogeneous Photonics Process Engineer

Xanadu; United States; Híbrido; USD 130 000 - 180 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Equity

Benefits

Resumo da oferta

Xanadu is seeking a Process Integration Engineer in Santa Clara, CA to join the Fabrication Process Engineering team. The role focuses on heterogeneous integration of photonic quantum computing hardware, advancing µTP, bonding, and related fabrication processes.

Lead metrology/failure analysis plans, collaborate with external industrial partners, and push state-of-the-art performance in photonics integration while traveling up to 20%. Equity and benefits are offered.

Qualificações

• PhD in physics, materials science, electrical engineering or related field.
• Experience with heterogeneous integration processes for integrated photonics and/or semiconductor applications, including µTP, die-to-wafer bonding, wafer-to-wafer bonding.
• Familiarity with semiconductor/photonics metrology and failure analysis techniques (e.g., SEM, TEM, AFM, ellipsometry).
• Experience with data analysis using Python/JMP/MATLAB.

Responsabilidades

• Design and execute process improvement experiments for heterogeneous integration of photonic components.
• Collaborate with external partners for process development and optimization experiments (µTP, bonding).
• Define metrology and failure analysis plans to identify failure modes and assess results.
• Coordinate with Xanadu's partners and internal photonics engineers to drive integration performance.
• Stay updated on new heterogeneous integration developments and apply learnings.
• Travel up to 20% as needed.

Conhecimentos

Python

JMP

MATLAB

Strong communication

Critical thinking

Formação académica

PhD in physics, materials science, electrical engineering or related field

Ferramentas

µTP

Die-to-wafer bonding

Wafer-to-wafer bonding

Descrição da oferta de emprego

Xanadu is seeking a Process Integration Engineer in Santa Clara, CA to join the Fabrication Process Engineering team. The role focuses on heterogeneous integration of photonic quantum computing hardware, advancing µTP, bonding, and related fabrication processes.

Lead metrology/failure analysis plans, collaborate with external industrial partners, and push state-of-the-art performance in photonics integration while traveling up to 20%. Equity and benefits are offered.