Head of Payments Platform Engineering & AI-Driven SDLC

Boost Payment Solutions; New York (NY); Hybrid; USD 200,000 - 220,000; Full time

Benefits offered by this job

Hybrid work model (NYC)

Competitive compensation

Medical, vision & dental insurance

401K with match

PTO

Job summary

Boost Payment Solutions is seeking an experienced Engineering Lead to shape our payments platform. This hands‑on role combines development, technical leadership, and AI‑enabled delivery across a distributed team.

You will mentor engineers, raise engineering standards, and drive architecture, testing, and production readiness. Based in the New York City area with a hybrid, full‑time setup, the role offers a competitive package including a 15% performance bonus and exposure to cloud‑native

Qualifications

• 5+ years in a technical leadership role leading distributed engineering teams
• Experience mentoring engineers and driving design reviews and coaching
• Hands-on coding and design with cloud-native systems on AWS
• Strong ownership mindset, clear communication and decision-making
• Experience with microservices, event-driven architecture and serverless patterns
• Familiarity with AI-assisted development tools and agentic SDLC practices
• Experience with CI/CD practices, release management, and traceability
• Knowledge of payment platforms or regulated fintech environments is a plus
• Excellent collaboration across Product, QA, DevOps and security teams
• Strong problem-solving and ability to deliver complex systems securely

Responsibilities

• Lead and mentor engineers across distributed teams
• Stay hands‑on with coding, design, debugging, and implementation
• Set quality standards and guide the team toward production‑ready solutions
• Coach engineers through architecture, testing, and production support
• Improve estimation, planning, and delivery confidence
• Design and build scalable, secure cloud‑native payments platform capabilities
• Shape technical roadmaps for payments platforms and integrations
• Strengthen delivery practices with CI/CD, Git branching, and release readiness
• Champion AI‑assisted SDLC practices and automation
• Collaborate with QA/DevOps to shift quality left in SDLC
• Drive technical debt reduction and continuous improvement

Skills

Leadership

Distributed teams

Java

AWS

Microservices

Event-driven architecture

Serverless

CI/CD

Code reviews

AI-assisted development

Architecture design

Tools

Terraform

CloudFormation

Datadog

Git

Jira

Job description

Boost Payment Solutions is seeking an experienced Engineering Lead to shape our payments platform. This hands‑on role combines development, technical leadership, and AI‑enabled delivery across a distributed team.

You will mentor engineers, raise engineering standards, and drive architecture, testing, and production readiness. Based in the New York City area with a hybrid, full‑time setup, the role offers a competitive package including a 15% performance bonus and exposure to cloud‑native